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Integrated printed circuit board

A printed circuit board and circuit layer technology, which is applied to printed circuit components, printed circuits connected to non-printed electrical components, etc. Interference, reduce dielectric loss, improve the effect of electrical performance

Active Publication Date: 2012-04-04
XFUSION DIGITAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides an integrated printed circuit board, which is used to solve the defect that the contradiction between anti-interference, dielectric loss and integration degree cannot be reconciled in the prior art, improve the anti-interference performance of components, and reduce the dielectric loss of signals. Improve electrical performance

Method used

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Embodiment Construction

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0019] figure 1 A side view of an integrated printed circuit board provided for an embodiment of the present invention, such as figure 1 As shown, this embodiment provides an integrated printed circuit board, which may include a printed circuit board 1 and passive components 2 . Among them, the printed circuit board 1 is a printed circuit boar...

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Abstract

The invention provides an integrated printed circuit board, which comprises a printed circuit board having a plurality of layers of structures and a passive element, wherein a cavity is formed in the printed circuit board; a plurality of circuit layers are arranged in the cavity; the cavity is formed by hollowing out a medium between two adjacent layers of structures of the printed circuit board;the circuit layers are comprised of metal wires in each layer of structure; through holes are formed between the plurality of circuit layers; and the plurality of circuit layers are connected throughthe through holes; and the passive element is arranged on the circuit layers. The integrated printed circuit board overcomes the drawback that the contradictions among the anti-interference performance, medium loss and integration cannot reconcile in the prior art, improves the anti-interference performance of the element, reduces signal medium loss and improves overall electrical performance.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of communications, and in particular to an integrated printed circuit board. Background technique [0002] With the continuous development of science and technology, the competition in the communication field is becoming more and more fierce. Therefore, low-cost, high-performance, and miniaturized product solutions have become an inevitable trend to occupy market opportunities. Traditional wireless products and network products such as duplexers, couplers, and feeder networks are purchased passive components, and each component is an independently designed device. The purchase cost is relatively high. lower. Therefore, integration has become the only way to realize the advantages of low cost and miniaturization of products. [0003] In the prior art, according to the integrated implementation of components, it can be divided into board-level integrated suspension microstrip line compo...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/18
Inventor 李宣宏熊献智刘红宝何平华
Owner XFUSION DIGITAL TECH CO LTD
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