Manufacturing method of PCB plate with copper pillar
A technology for PCB boards and manufacturing methods, applied in the reinforcement of conductive patterns, the formation of electrical connections of printed components, the secondary processing of printed circuits, etc., can solve the problems of formation, etc.
Active Publication Date: 2012-03-21
深圳市牧泰莱电路技术有限公司
View PDF0 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] The object of the present invention is to provide a method for manufacturing a PCB board with copper pillars, aiming to solve the problem of forming copper pillars at the solder joint position of the PCB board
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
specific Embodiment approach
[0036] In the embodiment of the present invention, according to the needs of the test, the PCB board may only have one side that needs to make copper columns (referred to as the side of the PCB board that needs to make copper columns in the present invention), and the other side does not need to make copper columns (in the present invention) It is called the side of the PCB board that does not need to make copper pillars).
[0037] The manufacturing process of the PCB board with copper pillars in the embodiment of the present invention is as follows:
[0038] First of all, according to the existing PCB board production process, complete the process from material cutting to post-curing, including:
[0039] 1. Cutting
[0040] Use the shears to cut the material according to the design size.
[0041] 2. Drilling
[0042] According to engineering data, use CNC drilling machine to drill holes to connect each layer.
[0043] 3. Immersion copper thickening
[0044] Use electrole...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention is suitable for the technical field of PCB manufacturing, providing a manufacturing method of a PCB plate with a copper pillar. The method comprises: a. plating copper to the PCB plate after solder resist, and plating copper on the solder resisting layer of the PCB plate; b. performing pattern plating to the welding point position of the PCB plate, which needs to manufacture the copper pillar, thickening the copper layer of the welding point position which needs to manufacture the copper pillar; c. performing pattern plating on the copper pillar, and plating a corrosion resistant layer on the welding point position which needs to manufacture the copper pillar; and d. etching the position except the position which needs to manufacture the copper pillar, reserving the copper layer of the position which needs to manufacture the copper pillar, and forming the copper pillar. The manufacturing method of the PCB plate with a copper pillar of the invention can form a raised copper pillar on the welding point position on the PCB plate to satisfy test requirements.
Description
technical field [0001] The invention belongs to the technical field of PCB (printed circuit board) manufacturing, and in particular relates to a method for manufacturing a PCB with copper pillars. Background technique [0002] The production method of the existing ordinary PCB board is mainly: after the PCB board is etched to form the required circuit, a layer of solder resist is covered on the surface of the circuit as a whole, and at the same time, in order to communicate with the component, according to the design requirements , the solder resist layer on the surface of the connected area (solder joints on the circuit and solder joints on the large copper surface) will be selectively removed. The specific production process is as follows: [0003] Cutting→drilling→immersion copper thickening→graphic making→copper tin plating→film removal and etching→solder mask pretreatment→silk screen solder mask→prebaking→exposure→developing→post-curing→surface treatment→silk printing c...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K3/24
Inventor 彭湘张奖平
Owner 深圳市牧泰莱电路技术有限公司