Glass sealing structure and manufacturing method thereof

A glass packaging and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of large stress between bonding interfaces and reduced packaging quality, and achieve the effect of reducing the impact and improving the packaging quality.

Active Publication Date: 2010-08-18
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] One object of the present invention is to provide a glass package structure and its manufacturing method, which can solve the problem that the quality of the package is degraded due to excessive stress between the bonding interfaces

Method used

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  • Glass sealing structure and manufacturing method thereof
  • Glass sealing structure and manufacturing method thereof
  • Glass sealing structure and manufacturing method thereof

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Embodiment Construction

[0027] According to the glass package structure and the manufacturing method thereof in the embodiments of the present invention, the thermal expansion coefficients of the first glass substrate, the glass glue and the second glass substrate are gradually increased or decreased to slow down the influence of thermal stress changes on the glass package and improve the performance of the glass package. Package quality.

[0028] First please refer to figure 1 , which shows a cross-sectional view of a glass package structure according to an embodiment of the present invention. The glass package structure 100 includes a first glass substrate 110 , a second glass substrate 120 and a glass glue 150 . The second glass substrate 120 is disposed parallel to one side of the first glass substrate 110 , and the glass adhesive 150 is sandwiched between the first glass substrate 110 and the second glass substrate 120 to form a closed ring. The first glass substrate 110 has a first coefficien...

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Abstract

The invention discloses a glass sealing structure and a manufacturing method thereof. The glass sealing structure comprises a first glass substrate, a second glass substrate and a glass cement material. The coefficients of thermal expansion of the first glass substrate and the second glass substrate are different, and the coefficient of thermal expansion of the glass cement material is between the coefficients of thermal expansion of the first glass substrate and the second glass substrate. A sealed space is formed among the first glass substrate, the second glass substrate and the glass cement material, and an organic luminous element is arranged in the sealed space. The manufacturing method comprises the following steps of: providing the first glass substrate and the second glass substrate; coating the glass cement material on the second glass substrate; heating and hardening the glass cement material; pairing the first glass substrate and the second glass substrate; and sintering the glass cement substrate so as to joint the two glass substrates.

Description

technical field [0001] The present invention relates to a packaging structure, and in particular to a glass glue packaging structure and a manufacturing method thereof. Background technique [0002] At present, in order to improve the airtightness between two glass substrates when manufacturing organic light-emitting display panels, the industry uses glass frit as a medium for bonding the two substrates, thereby encapsulating the display panel. During the manufacturing process, the glass adhesive is bonded to the two substrates separately by thermal sintering, so as to prevent external moisture and oxygen from entering the interior of the panel, so that the organic light-emitting elements in the organic display panel are protected from the effects of external moisture or oxygen. . [0003] However, when the glass adhesive is sintered, the entire panel (including the upper substrate, the lower substrate, and the glass adhesive) is affected by the high temperature during sint...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
Inventor 刘至哲徐士峰
Owner AU OPTRONICS CORP
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