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LED packaging structure

A technology for light-emitting diodes and packaging structures, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as uneven light color of light-emitting diodes

Inactive Publication Date: 2010-08-25
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to solve the aforementioned problems and the problems of the prior art, an object of the present invention is to block the overflow of fluorescent glue by forming a glue blocking structure, so that the fluorescent glue can evenly cover the light-emitting layer, so as to improve the problem of uneven light color of light-emitting diodes

Method used

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Embodiment Construction

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Abstract

The invention discloses an LED packaging structure which comprises a supporting substrate, an LED chip, a gel blocking structure and fluorescent gel. The LED chip is arranged on the supporting substrate and is electrically connected with the supporting substrate, and the LED chip is provided with a substrate and a luminescent layer arranged on the substrate. The gel blocking structure is arranged on the substrate of the LED chip and is circularly provided with the luminescent layer, and the fluorescent gel is filled into a region formed by the gel blocking structure, the substrate and the luminescent layer.

Description

Light-emitting diode packaging structure technical field The invention relates to a light emitting diode packaging structure. More specifically, the present invention relates to an LED packaging structure that improves phosphor distribution. Background technique Due to the characteristics of high brightness and low power consumption of light-emitting diodes (LEDs), LEDs have rapidly replaced traditional light sources in applications such as lighting and displays. As a light source for lighting, high-brightness white light is often required. Therefore, the industry has invested a lot of effort in the research and development of white light LEDs. At present, it is known that a high-brightness white light-emitting diode can be obtained by using phosphor powder in combination with a blue-light chip (for example: GaN). The blue light emitted by the chip will excite the phosphor to generate light of another wavelength (for example, yellow light). The desired color of white li...

Claims

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Application Information

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IPC IPC(8): H01L33/00
Inventor 翁思渊
Owner EVERLIGHT ELECTRONICS
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