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LED packaging structure

A technology of light-emitting diodes and packaging structures, which is applied to electrical components, circuits, semiconductor devices, etc., and can solve problems such as uneven light color of light-emitting diodes

Inactive Publication Date: 2012-10-24
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In order to solve the aforementioned problems and the problems of the prior art, an object of the present invention is to block the overflow of fluorescent glue by forming a glue blocking structure, so that the fluorescent glue can evenly cover the light-emitting layer, so as to improve the problem of uneven light color of light-emitting diodes

Method used

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Embodiment Construction

[0045] While the present invention will be described in terms of a number of preferred embodiments, other embodiments (including embodiments that do not provide all of the advantages and features set forth herein) known to those of ordinary skill in the art also fall within the scope of the present invention. within the scope of the present invention. Accordingly, the scope of the present invention is defined only with reference to the appended claims and their equivalents.

[0046] The purpose, functions, features, and advantages of the present invention can be further understood from the following preferred embodiments of the present invention with the accompanying drawings.

[0047] Please refer to figure 2 , is a schematic cross-sectional view of an LED packaging structure according to an embodiment of the present invention. The LED packaging structure of the present invention includes a supporting substrate 110 , a LED chip and a fluorescent glue 210 , and the fluoresc...

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Abstract

The invention discloses an LED packaging structure which comprises a supporting substrate, an LED chip, a gel blocking structure and fluorescent gel. The LED chip is arranged on the supporting substrate and is electrically connected with the supporting substrate, and the LED chip is provided with a substrate and a luminescent layer arranged on the substrate. The gel blocking structure is arrangedon the substrate of the LED chip and is circularly provided with the luminescent layer, and the fluorescent gel is filled into a region formed by the gel blocking structure, the substrate and the luminescent layer.

Description

technical field [0001] The invention relates to a light emitting diode packaging structure. More specifically, the present invention relates to an LED packaging structure that improves phosphor distribution. Background technique [0002] Due to the characteristics of high brightness and low power consumption of light-emitting diodes (LEDs), LEDs have rapidly replaced traditional light sources in applications such as lighting and displays. As a light source for lighting, high-brightness white light is often required. Therefore, the industry has invested a lot of effort in the research and development of white light LEDs. [0003] At present, it is known that a high-brightness white light-emitting diode can be obtained by using phosphor powder in combination with a blue-light chip (for example: GaN). The blue light emitted by the chip will excite the phosphor to generate light of another wavelength (for example, yellow light). The desired color of white light can be obtained...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
Inventor 翁思渊
Owner EVERLIGHT ELECTRONICS
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