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Low-temperature polysilicon thin film material

A technology of low-temperature polysilicon and thin-film materials, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of long crystallization time, induced metal residues, and uncontrollable induced metal diffusion, etc., to improve grain size, Shorten the time and reduce the effect of metal residue

Inactive Publication Date: 2012-07-04
GUANGDONG SINODISPLAY TECH
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Problems solved by technology

[0004] Among the known metal-induced crystallization film manufacturing technologies, the lateral metal-induced crystallization film technology obtains the best material and device performance, while the metal-induced crystallization film In order for the manufacturing technology to be practical, the following problems need to be solved urgently: 1. High concentration of induced metal residues; 2. Unable to control the diffusion of induced metals; 3. Long crystallization time

Method used

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  • Low-temperature polysilicon thin film material
  • Low-temperature polysilicon thin film material
  • Low-temperature polysilicon thin film material

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example 6

[0060] According to an example of the present invention (taking Example 6 as an example), the method for preparing polysilicon thin film material comprises the following steps:

[0061] (1) select the glass substrate, adopt the PECVD method to deposit 1.0 micron low-temperature silicon oxide on the glass substrate as the barrier layer;

[0062] (2) Etching the barrier layer into a groove-shaped structure, wherein the protrusions have a rectangular cross-section, a width of 3 nanometers, a height of 3 nanometers (D=3.0nm), and a protrusion spacing of 60 microns;

[0063] (3) A layer of controllable nickel source is formed on the first isolation layer by sputtering as a metal induction layer, and the surface nickel concentration is 5×10 13 cm -2 ;

[0064] (4) Depositing a layer of barrier layer on the induction layer by PECVD method as the second barrier layer, the thickness of the second barrier layer corresponding to the protrusion of the first barrier layer is 1.5 nanomete...

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Abstract

The invention provides a low-temperature polysilicon thin film material which is characterized by sequentially comprising a substrate, a first blocking layer, a metal inducing layer, a second blocking layer and a polysilicon layer from bottom to top, wherein the first blocking layer has a groove structure. The polysilicon thin film material can effectively control the dispersing direction and speed of inducing metal to an amorphous silicon layer and improve the crystallizing quality of polysilicon.

Description

technical field [0001] The invention belongs to the field of displays, in particular to a low-temperature polysilicon film material used for manufacturing active matrix displays. Background technique [0002] At present, there are roughly two types of thin film transistor (TFT) technologies used in active matrix display devices: amorphous silicon thin film TFT and polysilicon thin film TFT. The amorphous silicon thin film TFT process is mature and relatively simple, with high yield and low cost. The characteristics of TFT are mainly evaluated by the value of electron mobility. The electron mobility of amorphous silicon thin film TFT is about 1cm2 / Vs and the stability of amorphous silicon devices is poor, which makes it difficult to meet the fast switching color sequential liquid crystal display, current-driven organic light-emitting diode display and other integrated display requirements. The electron mobility of polysilicon thin film TFT is about 100cm2 / Vs, so polysilicon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/20H01L21/336
Inventor 彭俊华黄飚黄宇华
Owner GUANGDONG SINODISPLAY TECH
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