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Packaging structure of micro mechanical air pressure sensor chip and preparation method thereof

A technology of air pressure sensor and packaging structure, which is applied in the direction of instruments, measuring devices, measuring fluid pressure, etc., and can solve problems such as pressure errors

Inactive Publication Date: 2010-10-06
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most air pressure sensors use silicone gel to protect the stress film of the sensor, and the external pressure is transmitted to the stress film through the silicone gel. Although the gel is very soft, it will bring pressure errors to the test to some extent.

Method used

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  • Packaging structure of micro mechanical air pressure sensor chip and preparation method thereof
  • Packaging structure of micro mechanical air pressure sensor chip and preparation method thereof
  • Packaging structure of micro mechanical air pressure sensor chip and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The packaging structure of a micromechanical air pressure sensor chip provided by the present invention is as follows: Figure 1~6 Shown:

[0026] Step 1) Preparation of the casting mold of the base 1, the base 1 is provided with a metal pin 2 and an open cavity 3 for placing the air pressure sensor chip, and the base 1 is also provided with a vent hole 7, see figure 1 ;

[0027] Step 2) Apply patch red glue 8 in the open cavity 3, see figure 2 ;

[0028] Step 3) The sensor chip 9 is installed in the open cavity 3 by patch red glue, see image 3 ;

[0029] Step 4) Using wire bonding technology to prepare bonding wires 10 to realize the electrical connection between the input and output terminals of the sensor chip 9 and the metal pin 2, the metal pin 2 is located in the base 1 and extends to the outside of the base 1, see Figure 4 ;

[0030] Step 5) The PTFE microporous filter membrane 4 is fixed on the step 11 of the base 1 with adhesive, see Figure 5 ;

[0...

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Abstract

The invention relates to a packaging structure of a micro mechanical air pressure sensor chip and a preparation method thereof. The packaging structure comprises a base, wherein the base contains metal pins and is provided with an open cavity for placing an air pressure sensor chip; and the open cavity is provided with a polytetrafluoroethylene microporous filtering film. The preparation method comprises the following steps: a mould of the base is prepared by arranging the metal pins and the open cavity for placing an air pressure sensor chip and air holes on the base; patch red plastics are coated in drops in the open cavity; the sensor chip is installed in the open cavity by the patch red plastics; bonding lead wires is prepared by using lead wire bonding technology so as to realize the electric connection between the input end and output end of the sensor chip and the metal pins; the metal pins are positioned in the base and extend outside the base; polytetrafluoroethylene microporous filtering film is fixed on the base step by using cohesive glue; and a packaging head cover is installed on the step at the top end of the base.

Description

technical field [0001] The invention relates to a packaging structure of a micromechanical air pressure sensor chip and a preparation method thereof, in particular to a packaging structure of a MEMS capacitive air pressure sensor chip compatible with a CMOS standard process and a preparation method thereof. Background technique [0002] Air pressure sensors play an increasingly important role in weather forecasting, climate analysis, environmental detection, aerospace and other aspects. Especially in recent years, frequent weather and natural disasters have made pressure sensors more important in weather forecasting and climate analysis. There is a huge demand for the application of air pressure sensors. Due to the advancement of MEMS technology, air pressure sensors based on MEMS technology can improve the performance of air pressure sensors and reduce costs. Therefore, they have become a type of device that is mainly researched and developed by research institutions and un...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L19/00G01L19/06G01L9/12
Inventor 聂萌黄庆安秦明
Owner SOUTHEAST UNIV