Substrate processing apparatus

A substrate processing device and substrate technology, applied in spraying devices, devices for coating liquid on the surface, optics, etc., can solve problems such as unusable and complicated piping structures, reduce processing costs, simplify piping structures, and reduce the number of uses Effect

Active Publication Date: 2010-10-13
DAINIPPON SCREEN MTG CO LTD
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  • Abstract
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Problems solved by technology

[0006] However, in the nozzle initialization mechanism described above, the pre-discharging mechanism for pre-discharging the slit nozzle, the nozzle cleaning mechanism for cleaning the discharge port of the slit nozzle, and the standby container for the nozzle to stand by are separately constructed.
The cleaning solution used in the processing generated in each of the above-mentioned mechanisms has no relationship with its concentration or use state, so it cannot be used particularly effectively
[0007] In addition, since waste pipes for discharging the solution to the outside of the system and exhaust pipes for discharging the atmosphere of the solution must be installed in each mechanism, the piping structure becomes complicated and there are problems in maintenance.

Method used

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Embodiment Construction

[0039] Embodiments of the present invention will be described below with reference to the drawings.

[0040] In addition, in the following description, the three-dimensional XYZ orthogonal coordinate shown in a figure is used suitably when expressing a direction and an orientation. Here, the X-axis and Y-axis directions represent the horizontal direction, and the Z-axis direction represents the vertical direction (the +Z side is the upper side, and the -Z side is the lower side). In addition, for convenience, the X-axis direction is defined as the left-right direction (the +X side is the downstream side, and the -X side is the upstream side), and the Y-axis direction is defined as the depth direction (+Y side, -Y side).

[0041]

[0042] figure 1 It is a top view of the substrate processing apparatus 1 which is embodiment of this invention. The substrate processing apparatus 1 is configured as an apparatus (slit coater) for coating the surface of the substrate W by moving a...

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Abstract

This invention provides a substrate processing apparatus which makes good use of cleaner for initializing mechanism, and simplifies tubing structures. A nozzle maintenance unit of the substrate processing apparatus comprises a roller, a roller groove for holding the roller, a nozzle cleaning unit for cleaning the nozzle and a stand-by for the nozzle cleaning unit. The roller groove and the stand-by groove are connected with each other by a connecting pipe, wherein the solution within the stand-by groove is totally sent to the roller groove. Therefore, the cleaning fluid exhausted from the slit nozzle and the nozzle cleaning unit and processing fluid are stored in the roller groove temporarily; the fluid can be used to clean the outer circle surface of the roller which is sprayed with the processing fluid in the pre-spraying, moreover, because it is sufficient to install an exhaust tubing, an overflow effluent tubing and a roller groove effluent tubing on the roller groove, the tubing structure is simplified.

Description

technical field [0001] The present invention relates to a substrate processing apparatus for processing substrates for precision electronic devices such as square glass substrates for liquid crystals, semiconductor substrates, flexible substrates for thin-film liquid crystals, substrates for photomasks, and substrates for color filters (collar filter) or used in conjunction with These substrates are similar to various substrates. Background technique [0002] Conventionally, a substrate processing apparatus that applies a processing liquid to the surface of a substrate is used in various substrate manufacturing processes. As such a substrate processing apparatus, there is known a slit coater which, while ejecting a processing liquid from a slit nozzle, moves the slit nozzle straightly relative to the substrate to coat the entire substrate. treatment fluid. [0003] In order to perform the coating process by the slit coater with high precision, it is important that the fron...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C9/10B05C11/10B05C13/00B05B15/02B05B13/02
CPCB05C5/0204B05C9/08B05C11/023G03F7/70916H01L21/0274H01L21/0337
Inventor 高木善则
Owner DAINIPPON SCREEN MTG CO LTD
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