Device and method for nondestructively recycling chips

A chip and integrated technology, applied in the field of non-destructive chip recycling and reuse devices, can solve the problems of wasting precious resources, polluting the environment, not conforming to circular economy, energy saving and emission reduction, etc., and achieves saving precious resources and funds, and high recycling rate , the effect of energy saving and emission reduction

Inactive Publication Date: 2010-10-13
上海卡美循环技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After recycling the smart card with good sedimentation and electrical performance, and using only hundreds or thousands of times, the chip inside the smart card can still be recycled. Integrated structural design in the plastic substrate), the chip cannot be taken out intact and

Method used

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  • Device and method for nondestructively recycling chips
  • Device and method for nondestructively recycling chips
  • Device and method for nondestructively recycling chips

Examples

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Example Embodiment

[0031] The following combination Figure 1 to Figure 5 , A detailed description of the preferred embodiments of the present invention.

[0032] One of the embodiments:

[0033] Such as figure 1 As shown, figure 1 It is a schematic diagram of the overall structure of the present invention. A chip non-destructive recycling device, including a metal work surface 3 for placing a smart card, a heating unit 8 and a temperature control unit 4. The heating unit 8 is combined with the metal work surface 3 to form a smart card heating, and the heating unit 8 is arranged under the metal work surface 3. The temperature control unit 4 is used to control the heating temperature of the heating unit 8 and is connected to the heating unit 8.

[0034] Such as figure 2 As shown, figure 2 It is a schematic diagram of the metal work surface of the present invention. The surface of the metal working table 3 is coated with Teflon non-stick material 7. The smart card includes a smart card substrate 1...

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PUM

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Abstract

The invention relates to a device and a method for nondestructively recycling chips. The device comprises a metal working table top used for bearing an intelligent card, a heating unit and a temperature control unit, wherein the heating unit is arranged below the metal working table top; the heating unit is combined with the metal working table top to heat the intelligent card; or the heating unit heats the metal working table top and is embedded in the middle of the metal working table top; and the temperature control unit is used for controlling the heating temperature of the heating unit and is connected with the heating unit. The intelligent card to be recycled is flatly laid on the working table top, the temperature control unit controls temperature value of the heating unit, the heating unit heats the metal working table top to increase the temperature of the metal working table top and soften the substrate of the intelligent card, the chip is nondestructively separated from the softened substrate of the intelligent card, and the chip taken out is encapsulated again and is put into use after electrical property tests. The device and the method can be widely applied in various fields, have high recycling rate of the chip, and can save a large amount of precious resources and capital.

Description

technical field [0001] The invention relates to a technology for recycling electronic waste, in particular to a chip nondestructive recycling device and a recycling method thereof. Background technique [0002] A smart card is composed of a smart card substrate, coupling elements embedded in the substrate and expensive chips (CPU, IC, ID), and its theoretical life can be as long as 10 years or 100,000 times. After recycling the smart card with good sedimentation and electrical properties, and using only hundreds or thousands of times, the chip inside the smart card can still be recycled. The integrated structural design in the plastic substrate), the chip cannot be taken out intact and without damage, and can only be discarded as electronic waste as a whole, which wastes precious resources and pollutes the environment at the same time, which is not in line with the circular economy and energy conservation and emission reduction policies advocated by the state. . Contents ...

Claims

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Application Information

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IPC IPC(8): B09B3/00
Inventor 李达李庆胜
Owner 上海卡美循环技术有限公司
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