Structure of flat-plate transformer with all-metal outer cover and manufacturing method

Abstract

The invention discloses a structure of a flat-plate transformer with an all-metal outer cover and a manufacturing method thereof. The method of the invention comprises the following steps: forming multiple perforations on multiple substrates adjacent to each other on side surfaces; each perforation penetrates through the substrate; an accommodation hole and two side grooves are formed on the substrate; the one side groove corresponds to the side surface of the substrate; the accommodation hole and the side grooves respectively penetrate through the substrate; multiple substrates are electroplated, so as to form an electroplating layer on a first and second surfaces of the substrate, the perforation, the accommodation hole and the outer edge of the side groove. In the invention, a predetermined pattern is also provided on the first and second surfaces of the substrate; the predetermined pattern at least covers the perforation, the accommodation hole and the side groove, so as to enablethe electroplating layer to form a patterned electroplating layer; the patterned electroplating layer is arranged on the first and second surfaces by the predetermined pattern; and the patterned electroplating layer is also arranged on the perforation, the accommodation hole and the outer edge of the side groove.

Description

Technical field: [0001] The present invention relates to a structure and a manufacturing method of a planar transformer, in particular to a structure and a manufacturing method of a planar transformer with an all-metal outer cover. Background technique: [0002] Transformer is one of the passive components. It is widely used in information, communication and consumer electronics products. Its main functions can be roughly divided into three categories: EMI (electromagnetic interference) prevention, signal processing and power application. With the progress of the information industry, electronic products are under the development trend of miniaturization, portability, high-density assembly of components and reduction of production costs. The conversion rate has increased every year. Among them, the chip inductor transformer has a relatively complex structure and high manufacturing process difficulty, and the chip ratio is much lower than that of resistors and capacitors. ...

AI Technical Summary

Problems solved by technology

However, there is no electroplating layer 98 around the outer edge of the receiving hole 96 and the side surface of the substrate 91. Therefore, when the circuit pattern is complicated, the upper and lower surfaces (92, 93) are often unable to conduct the circuit, and it is necessary to increase the use of the substrate. The thickness of 91 will relatively increase the electromagnetic interference (EMI) of the planar transformer 9, so how to solve the above problems has always been an urgent need for solutions and improvements.

Images