Impact tester of single soldered ball

A tester and single-welding technology, which is applied in the direction of impact testing, testing of material strength using one-time impact force, testing of machine/structural components, etc., can solve problems such as low precision, complicated and lengthy testing process, and achieve convenient positioning and start-up. Precise initial conditions, application-specific enhancements
CN101886997BInactive Publication Date: 2012-01-11GUANGZHOU HKUST FOK YING TUNG RES INST
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GUANGZHOU HKUST FOK YING TUNG RES INST
Publication Date
2012-01-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses an impact tester of a single soldered ball, which comprises an alignment system, an impact system and a sampling platform system, wherein the alignment system comprises an XYZ working table, and a sampling platform is fixed on the XYZ working table and stretches outwards horizontally; and a supporting frame of the impact system is provided with a probe-type distance measure sensor through a support. The impact tester can ensure that the whole testing process is conveniently and accurately monitored and analyzed and the application type of an original instrument is greatly enhanced. The impact tester can surely guarantee the accuracy of a starting condition; an optimized device can ensure that a tested component is completely horizontal and fixed; and an accurate sensor is used for conveniently positioning the impact height. Besides, automatic system control is also applied to an improved instrument. A computer data acquisition card is used for performing real-time monitoring and data acquisition on the complete testing process, and performing feedback regulation on a test condition according to a result, so the operating process is simple, convenient and accurate, and the computer data acquisition card is greatly favorable for carrying out an acquisition test.
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Description

technical field

[0001] The invention relates to a test instrument, in particular to a single ball welding anti-shear strength impact tester. Background technique

[0002] The ball array is widely used in electronic packaging technology, and the packaging strength between the ball array and the substrate is one of the basic standards generally recognized by the industry. Previously, to test this strength, the industry generally used a single solder ball shear test to obtain reliable solder ball attachment strength results. However, due to the fact that the low-rate shear test cannot predict the high-strain-rate impact under real conditions, it was later developed into a single-ball impact tester, which has been widely recognized for its high-speed and accurate test results.

[0003] Existing single solder ball impact tester, such as the Chinese invention patent application "Single Solder Ball Impact Tester" published on June 10, 2009 in the Chinese Invention Patent Bulletin,...

Claims

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