Film-coating device

Abstract

The invention relates to a film-coating device comprising a film-coating chamber, a target material bearing device, a base material bearing device, a first driving device and a second driving device, wherein the target material bearing device and the base material bearing device are arranged in the film-coating chamber; the target material bearing device comprises a body and at least one target material seat, wherein a sputtering cavity is arranged in the body, the body is provided with an inner side wall around the sputtering cavity, and the target material seat is arranged on the inner sidewall; the base material bearing device is arranged in the sputtering cavity and comprises at least one base material seat; the first driving device is connected with the base material bearing device and used for driving the base material bearing device to rotate relative to the target material bearing device; and the second driving device is connected with the target material bearing device and used for driving the target material bearing device to rotate around the sputtering cavity. Because the base material bearing device can rotate relative to the target material bearing device, all different surfaces of base materials, which are to be coated, can be made to face to target materials and the uniformity of a high film layer can be enhanced; and in addition, because the target material bearing device can rotate around the sputtering cavity, the consumption degree of the target materials is more uniform.

Description

technical field [0001] The invention relates to a coating device. Background technique [0002] The sputtering device usually sets the substrate to be plated opposite to the target, and uses plasma to bombard the target, so that the atoms of the target are sputtered onto the substrate under the action of the plasma to form a film layer. The current sputtering device generally fixes the target, and the substrate to be plated can translate relative to the target, but cannot rotate relative to the target. When the shape of the substrate to be plated is relatively complex, the cross-sectional area of ​​some surfaces to be plated on the substrate to be plated relative to the target plane is relatively small, so the film layers plated on these surfaces to be plated are larger than those on other surfaces. Thin, resulting in uneven thickness of the coating layer on the substrate to be coated. Contents of the invention [0003] In view of this, it is necessary to provide a coati...

AI Technical Summary

Problems solved by technology

When the shape of the substrate to be plated is relatively complex, the cross-sectional area of ​​some surfaces to be plated on the substrate to be plated relative to the target plane is relatively small, so the film layers plated on these surfaces to be plated are larger than those on other surfaces. Thin, resulting in uneven thickness of the coating layer on the substrate to be coated

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