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Flat type heat radiating mechanism on heating surface with parallel radiator fins

A heating surface, flat technology, applied in the direction of electric solid device, semiconductor device, cooling/ventilation/heating transformation, etc., can solve the problem of difficulty in ensuring the space for radiator storage, the cost of electronic equipment, etc., and achieve the effect of improving heat dissipation performance

Active Publication Date: 2013-08-07
FANUC LTD
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] However, in the entire electronic equipment case, the arrangement density of various electronic equipment continues to increase, and it is difficult to ensure the space for accommodating the radiator.
In addition, the use of the heat pipe 22 has the following problems: it is necessary to fix the heat receiving block 21 and the vertical fin type heat sink 20 in separate places, and to make the heat receiving block 21 in close contact with the CPU. The increase in man-hours increases the cost of electronic equipment

Method used

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  • Flat type heat radiating mechanism on heating surface with parallel radiator fins
  • Flat type heat radiating mechanism on heating surface with parallel radiator fins
  • Flat type heat radiating mechanism on heating surface with parallel radiator fins

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no. 1 approach

[0042] Such as figure 1 As shown, the heat-receiving surface parallel-fin type flat heat dissipation structure 1 is composed of a columnar portion 2 and a plurality of plate-shaped heat dissipation fins 3 . The columnar portion 2 and the plate-shaped fins 3 are formed of the same metal material. Columnar portion 2 is formed with four sides (such as Figure 3B As shown, the shape of the sides 2a, 2b, 2c, 2d) includes one of the sides, that is, the side surrounded by the dotted line 31-dotted line 31 and the edge of the columnar part 2 ( Figure 3B The side face 2 a ) is shown as the heating surface 4 . A dashed-dotted line denoted by reference numeral 30 indicates the long-axis direction of the columnar portion 2 . Symbol W, symbol H, and symbol L represent the width, height, and depth of the heat-receiving-surface-parallel-fin-type flat heat dissipation structure 1, respectively. The depth L is set according to the area of ​​the region to be cooled or the space in which t...

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Abstract

The invention provides a flat type heat radiating mechanism on heating surface with parallel radiator fins, which takes the side extending from a horizontal direction of a long axis as a columnar part of the heating surface. The other two sides on the columnar part extend at two totally opposite directions and are made from plural plate shaped heating radiating fins. The height of the heat radiating mechanism is defined as H (mm), and the width thereof as W (mm). The relation between H and W can be represented as H <= (W-47) 0.5 / 0.6+5 wherein 5mm<=H and 47mm<=W. The calculating unit is millimeter.

Description

technical field [0001] The invention relates to a heat sink, which is used for cooling semiconductor components such as IC and CPU or other electronic components with heat-generating parts that are accommodated in an electronic equipment case and generate heat during operation. Background technique [0002] In recent years, in electronic equipment, even among the electronic components housed in the case of electronic equipment, the CPU (central processing unit) has become the electronic component that generates the most heat during operation, especially as the clock frequency of the operating clock has increased in recent years. one. From the viewpoint of ensuring the operational stability and operating life of the CPU, measures against heat dissipation are also important issues. For example, in order to dissipate heat from the CPU, a water-cooled water-cooling module or an air-cooled heat sink structure (radiator) provided with heat dissipation fins is used. [0003] The ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/367
Inventor 泷川宏野田浩桥本良树青山一成
Owner FANUC LTD
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