Mounting substrate, and method for manufacturing thin light-emitting device using same

A technology for mounting a substrate and a manufacturing method, which is applied in the directions of electrical components, electric solid-state devices, circuits, etc., can solve problems such as hindering stability, impairing appearance, and short-circuiting, and achieves the effect of easy handling
CN101930964BInactive Publication Date: 2012-08-08ELEMENT DENSHI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ELEMENT DENSHI
Publication Date
2012-08-08
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a mounting substrate and a method for manufacturing thin light-emitting device using same, which is capable of inhibiting generation of burrs and realizing mass production of light-emitting device. In the mounting substrate of the invention, a conductive foil is removed at the edge of a unit. In particular, on the upper surface of the mounting substrate, a unit formed of a first electrode part and a second electrode part encircling a mounting part is formed, a plurality of units are arranged in columns. Furthermore, on the lower surface of the mounting substrate, a first external take-out electrode part connected with the first electrode is provided, and a second external take-out electrode part connected with the second electrode is provided. Besides, resin material for forming the mounting substrate, without the existence of conductive foil and other metal materials, is provided among the units. Therefore, in the manufacture of the light-emitting device, even if the mounting substrate between the units is cut off, the burr is not generated as the metal material is not cut off.
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Description

technical field

[0001] The present invention relates to a mounting substrate and a method for manufacturing a thin light-emitting device in which a light-emitting element is mounted on a mounting portion on a conductive foil using the mounting substrate. multiple electrodes. Background technique

[0002] Figure 7 A light-emitting device is shown in which light emitted from a light-emitting element is prevented from being absorbed in a base substrate, and loss of light emission is suppressed to improve overall luminance.

[0003] This light emitting device is composed of a light emitting element 100 , a base substrate 200 , a substrate electrode 300 , a connection electrode portion 400 , a light reflection portion 500 , a hole portion 600 , and a plating layer 700 . The light emitting element 100 is a Group III nitride compound semiconductor light emitting element. The base substrate 200 is an insulating substrate formed of resin such as polyimide, epoxy glass, or BT resin...

Claims

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