System on chip adopting ARINC 659 rear panel data bus interface chip
A backplane data bus and interface chip technology, applied in the field of computer communication, can solve problems such as no bus products, and achieve the effect of improving reliability, strong reliability and high reliability
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[0030] See figure 1 The present invention provides an ARINC 659 backplane data bus interface chip system on chip. The ARINC 659 backplane bus interface chip (abbreviation: interface chip, BIU) interface chip is equipped with a Harvard architecture dedicated frame description language (FDL) micro The system-on-chip of the instruction processor, the BIU mainly contains five parts: PCI bus interface module, dual-port RAM, bus command table mapping memory (referred to as: mapping RAM), command table self-loading function module and protocol processing function module; command table The self-loading function module is electrically connected to the ARINC 659 bus protocol processing module through the bus command table mapping memory; the PCI bus interface module is electrically connected through the dual-port RAM and the ARINC 659 bus protocol processing module; the PCI bus interface module is electrically connected to the ARINC 659 bus protocol processing The module is electrically ...
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