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Semiconductor packaging structure and packaging technology thereof

A technology of packaging structure and packaging process, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of long production cycle and low process yield, achieve large process flexibility and simplify packaging process, the effect of improving production yield

Active Publication Date: 2011-01-05
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since electronic components usually have standard specifications and specific electrical characteristics, in order to accommodate electronic components with various electrical characteristics, component embedded substrates must be customized, resulting in low process yield and long production cycle

Method used

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  • Semiconductor packaging structure and packaging technology thereof
  • Semiconductor packaging structure and packaging technology thereof
  • Semiconductor packaging structure and packaging technology thereof

Examples

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Embodiment Construction

[0069] Although "first", "second" or other similar terms are used in this application to describe elements, regions, layers or parts, such terms are not used to limit the elements, regions, layers or parts, but only It is used to distinguish different components, regions, layers or parts. Therefore, the first element, region, film layer or part may also be a second element, region, film layer or part without departing from the scope of the teachings of the present invention.

[0070] Embodiments of the present invention propose a method for manufacturing a semiconductor package structure with embedded components, which at least includes providing more than two pre-formed building blocks (ie, structural components), and assembling at least one electronic component (active or passive) components) to at least one of the building blocks, and bonding the building blocks to obtain a component-embedded semiconductor package structure. Therefore, the packaging process can provide gre...

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Abstract

The present invention discloses a semiconductor packaging structure with built-in electronic elements and packaging technology thereof. By means of more than two structural modules formed in advance, the electric elements can be assembled on the structural modules after conjoining so as to obtain the semiconductor packaging structure. By means of the structural modules formed in advance, it is possible to simplify the packaging technology of the semiconductor packaging structure and provide a great technology flexibility. Thereby, it is possible to shorten assembling time interval of the semiconductor packaging structure and improve finished product yield.

Description

technical field [0001] The invention relates to a substrate, a semiconductor packaging structure and a manufacturing method thereof, and in particular to a component embedded substrate, a semiconductor packaging structure using the component embedded substrate and a manufacturing method thereof. Background technique [0002] Generally speaking, a circuit substrate is formed by alternately stacking a plurality of patterned circuit layers and a plurality of dielectric layers, wherein the dielectric layer is used to isolate two adjacent patterned circuit layers. Adjacent patterned circuit layers can be electrically connected to each other through plated through holes (PTH) or conductive vias passing through the dielectric layer. In addition, various electronic components (such as active or passive components) can be disposed on the surface of the circuit substrate or embedded in the circuit substrate, so as to achieve the purpose of electrical signal transmission through the de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L21/48H01L21/60
CPCH01L24/85H01L21/563H01L2224/81801H01L25/105H01L2224/73265H01L2224/85411H01L24/45H01L25/0657H01L2224/13144H01L2924/0105H01L2224/48091H05K3/4623H01L2224/45124H01L2924/01046H01L23/49816H01L2924/01078H01L2224/73203H01L2924/01028H01L2924/19041H01L23/5389H01L24/16H01L24/48H01L2924/01079H01L2224/45147H05K1/186H01L2224/85444H01L2924/15311H01L24/13H01L2924/01047H01L2224/13147H01L2224/45144H01L2924/01013H01L2924/15331H01L2224/85439H01L2224/81192H01L2924/19043H01L2224/48227H01L2924/3025H01L24/81H01L2224/48611H01L2224/48639H01L2224/48644H01L2224/48711H01L2224/48739H01L2224/48744H01L2224/48811H01L2224/48839H01L2224/48844H01L2924/00014H01L2924/00
Inventor 博德·K·艾皮特
Owner ADVANCED SEMICON ENG INC
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