Method for inserting radio frequency identification RFID signal in printed circuit board
An RFID label and printed circuit board technology, applied in the field of PCB manufacturing, can solve the problems of peeling, scratching, inability to protect the label well, wasting time, etc., and achieve the effect of reducing the cost of packaging
Active Publication Date: 2012-12-26
厦门清芯集成科技有限公司
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Problems solved by technology
However, manual mounting is a waste of time, and the form of surface mounting cannot protect the label well, so as to ensure the functions of anti-counterfeiting and tracing
Because the label attached to the surface may be damaged artificially or accidentally, such as peeling, scratching, etc.
Method used
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[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0028] In the present invention, under the existing PCB board design, two corresponding signal layers are added for chip implantation and antenna fabrication.
[0029] 1) In the design structure of the PCB board, on the basis of not changing the order and design of the original stack structure, add two signal layers for chip embedding;
[0030] 2) For a PCB board with a core board structure, the two signal layers are symmetrical up and down on the core board, one of which is used as a dummy layer, that is, the dummy signal layer, and the...
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The invention provides a method for inserting a radio frequency identification RFID signal in a printed circuit board, relates to the fields of PCB manufacture and UHF RFID application, and discloses a method for inserting UHF RFID in PCB to achieve the aims of counterfeiting and tracking. Different from that of directly embedding or adhering a packaged RFID label on the surface, the method is characterized in that the unpackaged RFID chip is directly inserted in the PCB by using a mode of adding a new electric signal layer to complete antenna manufacture in the PCB and complete interconnection of the antenna and the chip in the PCB by adopting the Build-up technology. The method saves primary package of the RFID chip and the antenna, is compatible with chip embedding, antenna manufacture and PCB manufacture process, and can manufacture the RFID label on the whole board simultaneously so as to reduce the application cost of embedding the RFID label.
Description
technical field [0001] The present invention relates to the field of PCB manufacturing and the field of UHF RFID application, mainly a structure of embedding UHF RFID in the PCB, embedding and manufacturing the RFID chip and the antenna in the PCB respectively, and completing the interconnection, so that the anti-counterfeiting and The role of tracer. Background technique [0002] According to the idea of modern electronic assembly, printed circuit boards are divided into different types at different stages of the electronic assembly process. Different types of printed circuit boards (Printed Circuit Board, PCB) have slightly different functions and different application directions. Packaging substrates are used in the first level of electronic assembly. A single chip is directly mounted on this substrate to form a packaged substrate; conventional printed circuit boards are used in second and third-level electronic assembly, as the mother board that constitutes the syste...
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IPC IPC(8): G06K19/077
Inventor 蔡坚浦园园王谦王水弟贾松良
Owner 厦门清芯集成科技有限公司