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Heating device, substrate processing apparatus, and method of manufacturing semiconductor device

A technology for heating devices and substrates, which is used in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve problems such as component damage, and achieve the effects of reducing damage, inhibiting offset, and inhibiting shearing

Active Publication Date: 2013-10-02
KOKUSAI DENKI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In addition, in the above-mentioned heating device, if the heat generating body thermally expands as the temperature rises, the heat generating body will come into contact with the heat insulator, and these components may be damaged.

Method used

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  • Heating device, substrate processing apparatus, and method of manufacturing semiconductor device
  • Heating device, substrate processing apparatus, and method of manufacturing semiconductor device
  • Heating device, substrate processing apparatus, and method of manufacturing semiconductor device

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no. 1 approach

[0069] Next, a first embodiment of the present invention will be described with reference to the drawings.

[0070] figure 1 is a vertical cross-sectional view showing the substrate processing apparatus according to the first embodiment of the present invention. figure 2 It is a perspective view of the heating unit of 1st Embodiment of this invention. image 3 It is a partially enlarged view of the heating unit according to the first embodiment of the present invention. Figure 4 (a) is a schematic diagram illustrating a linear material constituting an annular portion according to the first embodiment of the present invention, Figure 4 (b) is a schematic diagram illustrating an example of a plate-shaped material constituting the annular portion. Figure 19 (a) is a partial enlarged view of the annular portion of the first embodiment of the present invention, Figure 19 (b) is a side view of an enlarged part.

[0071] (1) Structure of the substrate processing device

[...

no. 2 approach

[0151] Next, a second embodiment of the present invention will be described with reference to the drawings.

[0152] Figure 25 is a vertical cross-sectional view showing a substrate processing apparatus according to a second embodiment of the present invention. Figure 26 It is a perspective view of the heating element of 2nd Embodiment of this invention. Figure 27 (a) is a partially enlarged view of an annular portion according to a second embodiment of the present invention, Figure 27 (b) is a side view of an enlarged part. Figure 28 It is a partial enlarged view of the heat insulator holding the annular part of the second embodiment of the present invention, Figure 28 (a) represents the situation before warming, Figure 28 (b) shows the situation after temperature rise.

[0153] (1) Composition of heating element and heat insulator

[0154] The substrate processing apparatus of this embodiment is different from the above-mentioned embodiment in the configuration of...

no. 3 approach

[0169] Next, a third embodiment of the present invention will be described with reference to the drawings.

[0170] Figure 6 It is a horizontal cross-sectional view of the heating unit 30 before temperature rise according to the third embodiment of the present invention. Figure 7 It is a horizontal cross-sectional view of the heated heating unit 30 according to the third embodiment of the present invention.

[0171] In the substrate processing apparatus of this embodiment, if Figure 6 As shown, the distance between the bottom surface 40e and the central portion 42e is set so that at least when the annular portion 42R is in a room temperature state, it becomes larger as the distance from the pair of power supply portions 45, 46 increases (that is, it is set in a room temperature state). When it becomes A Figure 7 As shown, the distance between the bottom surface 40e and the central portion 42e is set so that, at least when the annular portion 42R is in the temperature stat...

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Abstract

Provided are a heating device, a substrate processing apparatus, and a method of manufacturing a semiconductor device. The heating device comprises: a heating element including a mountain part and a valley part that are alternately connected in plurality in a meander shape with both ends being fixed; holding body receiving parts respectively installed at ends of the valley parts and formed as cutout parts having a width larger than a width of the valley part; an insulating body installed at an outer circumference of the heating element; a holding body disposed in the holding body receiving part and fixed to the insulating body; the heating element having a ring shape; the insulating body installed in a manner of surrounding the outer circumference of the heating element; and a fixation part configured to fix the heating element to an inner wall of the insulating body.

Description

technical field [0001] The present invention relates to a heating device, a substrate processing device for processing a substrate, and a method of manufacturing a semiconductor device. Background technique [0002] As one step of a method of manufacturing a semiconductor device such as a DRAM, a substrate processing step of heating and processing a substrate such as a silicon wafer is performed. This step is carried out by a substrate processing apparatus having a processing chamber for accommodating and processing a substrate, and a heating device for heating the processing chamber. The heating device has an annular heat generating body surrounding the periphery of the processing chamber and an annular heat insulator provided on the periphery of the heat generating body. On the upper and lower ends of the heating element, a plurality of peaks and valleys (notches) are alternately connected, whereby the heating element is formed in a meandering shape (for example, refer to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00
CPCH01L21/324H01L21/67098H01L21/6719H01L21/67778
Inventor 村田等小杉哲也杉浦忍上野正昭
Owner KOKUSAI DENKI KK
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