Method for arranging cooling for a component and a cooling element

A technology for cooling components and components, used in electrical components, printed circuit components, cooling/ventilation/heating retrofits, etc., can solve problems such as reducing lifespan, limiting maximum feeding power, etc., to reduce operating temperature, increase electrical power, and reduce The effect of production cost

Inactive Publication Date: 2011-02-09
VALTION TEKNILLINEN TUTKIMUSKESKUS +2
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In an electrical component, even a small rise in heat of a few degrees can significantly reduce its life or limit the maximum fed power

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for arranging cooling for a component and a cooling element
  • Method for arranging cooling for a component and a cooling element
  • Method for arranging cooling for a component and a cooling element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In the following description, the embodiments are merely examples and a person skilled in the art can also put into practice the basic idea of ​​the invention in another way than that described. Although an explanation may refer to an embodiment or embodiments in several places, this does not mean that the reference is to only one of the described embodiments or that a described feature is only useful in one of the described embodiments of. Separate features of two or several embodiments may be combined and thus form new embodiments of the invention.

[0037] Figure 1 is presented in conjunction with the description of the prior art.

[0038] A circuit board or substrate supporting the electrical components is not necessarily required between the cooling element according to the invention and the electrical components fastened thereto. In the first stage of the construction method according to the invention, a thin layer of insulating material is formed onto the surfa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

In the method according to the invention, the discrete electric component to be cooled is connected to the cooling element without a circuit board or substrate. In the method, a layer of insulating material is thermally sprayed (402) on one surface of the cooling element. The connection points and conductors required by the discrete electric component are formed (403) on top of this insulating layer. The discrete electric component is glued (404) onto the insulating layer. Subsequently, the electrical connections for the discrete component are made. After the discrete component has been electrically connected (405), it can still be protected (406) using a layer of thermally sprayed insulating material.

Description

technical field [0001] The invention relates to a method for producing a cooling element for electrical components. The invention also relates to a cooling element produced according to said method. Background technique [0002] Temperature control of electrical components that use a large amount of power compared to their size and are part of electrical equipment has a decisive effect on their operation. Examples of such components are power semiconductors, processor units and optical components, such as light diodes commonly referred to as LEDs (Light Emitting Diodes). [0003] Proper cooling can be used to reduce the operating temperature of electrical components. As a result of the reduced temperature, the electrical component is able to function more efficiently and / or the lifetime of the component is extended in terms of its use. The temperature of the electrical components can be reduced using, for example, a separate fan which is used to direct cooling air over th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/04H01L23/373H05K7/20H05K1/05
CPCH05K3/048H01L2924/09701H05K1/053H05K2203/1366H05K2203/1131C23C4/18H01L23/4985H01L2924/01025H05K1/056H01L2224/48091H01L2924/01046H01L33/64H01L2924/30107H01L23/36H01L2924/3011H01L24/48H01L2924/01079H01L2924/15183H05K2203/1344H01L23/60H01L2924/10253H05K3/284H05K2201/10106H01L2924/01057H01L23/142H01L21/4846C23C4/10H01L2924/3025Y02T50/67H01L2924/0102H01L2924/00014H01L2924/12041H01L2924/181Y10T29/49169H01L2924/00H01L2224/45099H01L2224/45015H01L2924/207Y02T50/60
Inventor 基默·乔克莱伦艾拉·佩塔杰贾维
Owner VALTION TEKNILLINEN TUTKIMUSKESKUS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap