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Method for arranging cooling for a component and a cooling element

A technology for cooling components and components, used in electrical components, printed circuit components, cooling/ventilation/heating retrofits, etc., can solve problems such as reducing lifespan, limiting maximum feeding power, etc., to reduce operating temperature, increase electrical power, and reduce The effect of production cost

Inactive Publication Date: 2011-02-09
VALTION TEKNILLINEN TUTKIMUSKESKUS +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In an electrical component, even a small rise in heat of a few degrees can significantly reduce its life or limit the maximum fed power

Method used

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  • Method for arranging cooling for a component and a cooling element
  • Method for arranging cooling for a component and a cooling element
  • Method for arranging cooling for a component and a cooling element

Examples

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Embodiment Construction

[0036] In the following description, the embodiments are merely examples and a person skilled in the art can also put into practice the basic idea of ​​the invention in another way than that described. Although an explanation may refer to an embodiment or embodiments in several places, this does not mean that the reference is to only one of the described embodiments or that a described feature is only useful in one of the described embodiments of. Separate features of two or several embodiments may be combined and thus form new embodiments of the invention.

[0037] Figure 1 is presented in conjunction with the description of the prior art.

[0038] A circuit board or substrate supporting the electrical components is not necessarily required between the cooling element according to the invention and the electrical components fastened thereto. In the first stage of the construction method according to the invention, a thin layer of insulating material is formed onto the surfa...

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Abstract

In the method according to the invention, the discrete electric component to be cooled is connected to the cooling element without a circuit board or substrate. In the method, a layer of insulating material is thermally sprayed (402) on one surface of the cooling element. The connection points and conductors required by the discrete electric component are formed (403) on top of this insulating layer. The discrete electric component is glued (404) onto the insulating layer. Subsequently, the electrical connections for the discrete component are made. After the discrete component has been electrically connected (405), it can still be protected (406) using a layer of thermally sprayed insulating material.

Description

technical field [0001] The invention relates to a method for producing a cooling element for electrical components. The invention also relates to a cooling element produced according to said method. Background technique [0002] Temperature control of electrical components that use a large amount of power compared to their size and are part of electrical equipment has a decisive effect on their operation. Examples of such components are power semiconductors, processor units and optical components, such as light diodes commonly referred to as LEDs (Light Emitting Diodes). [0003] Proper cooling can be used to reduce the operating temperature of electrical components. As a result of the reduced temperature, the electrical component is able to function more efficiently and / or the lifetime of the component is extended in terms of its use. The temperature of the electrical components can be reduced using, for example, a separate fan which is used to direct cooling air over th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/04H01L23/373H05K7/20H05K1/05
CPCH05K3/048H01L2924/09701H05K1/053H05K2203/1366H05K2203/1131C23C4/18H01L23/4985H01L2924/01025H05K1/056H01L2224/48091H01L2924/01046H01L33/64H01L2924/30107H01L23/36H01L2924/3011H01L24/48H01L2924/01079H01L2924/15183H05K2203/1344H01L23/60H01L2924/10253H05K3/284H05K2201/10106H01L2924/01057H01L23/142H01L21/4846C23C4/10H01L2924/3025Y02T50/67H01L2924/0102H01L2924/00014H01L2924/12041H01L2924/181Y10T29/49169H01L2924/00H01L2224/45099H01L2224/45015H01L2924/207Y02T50/60
Inventor 基默·乔克莱伦艾拉·佩塔杰贾维
Owner VALTION TEKNILLINEN TUTKIMUSKESKUS
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