Electrolytic solution for producing electrolytic copper foil
A technology of electrolytic copper foil and electrolyte, which is applied in the manufacture of electrolytic copper foil and the manufacture of copper-clad laminates, and can solve problems such as shortened drum life
Inactive Publication Date: 2012-07-11
JX NIPPON MINING & METALS CORP
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Problems solved by technology
[0013] In Japanese Patent Laid-Open No. 7-278866, as a result of reducing the glue concentration, the elongation at high temperature is improved, but there is a problem that the drum life is shortened
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[0063] Hereinafter, in order to further understand the present invention and its advantages, examples will be described, but the present invention is not limited to these examples.
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Abstract
An electrolytic copper solution for producing an electrolytic copper foil is provided which can improve elongation properties while reducing the profile of the rough surface. The electrolytic solution for electrolytic-copper foil production is a sulfuric-acid-acidified aqueous copper sulfate solution containing: bromide ions derived from bromine, an inorganic acid thereof, an inorganic salt thereof, or a mixture of these; a glue; and chloride ions.
Description
technical field [0001] This invention relates to the copper electrolyte solution used for manufacture of electrolytic copper foil. Moreover, this invention relates to the manufacturing method of an electrolytic copper foil. Further, the present invention relates to copper clad laminates (copper clad laminates) board) manufacturing method. Background technique [0002] The printed circuit board is an indispensable part in the operation of various electronic instruments, and is usually manufactured through the following manufacturing steps. First, a copper-clad laminate is produced by laminating and bonding a copper foil to an insulating substrate such as a synthetic resin plate or film under high temperature and pressure with or without an adhesive. Next, after printing the circuits necessary for forming the intended circuit, an etching process for removing unnecessary parts is performed. Finally, the desired electronic components are soldered to form various printed cir...
Claims
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IPC IPC(8): C25D3/38C25D1/00C25D1/04
CPCC25D1/20C25D1/04C25D3/38H05K1/09
Inventor 花房干夫
Owner JX NIPPON MINING & METALS CORP