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Multilayer wiring, semiconductor device, substrate for display and display

A technology for display devices and semiconductors, which is applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve problems such as cost reduction and increase in display devices.

Inactive Publication Date: 2011-02-16
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, there is a tendency to increase the number of display devices equipped with all-monolithic display device substrates in which peripheral circuits necessary for driving, such as a driver circuit, are formed on the substrate in order to achieve thinning and cost reduction.

Method used

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  • Multilayer wiring, semiconductor device, substrate for display and display
  • Multilayer wiring, semiconductor device, substrate for display and display
  • Multilayer wiring, semiconductor device, substrate for display and display

Examples

Experimental program
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Effect test

Embodiment approach 1

[0039] figure 1 It is a schematic diagram showing the display device substrate of Embodiment 1, (a) is a plan view, and (b) is a cross-sectional view taken along line X1-Y1 in (a).

[0040] The display device substrate 100 of Embodiment 1 is a display device substrate suitable for a display device such as a liquid crystal display device. Such as figure 1 As shown in (a) and (b), the substrate 100 for a display device has a structure in which a semiconductor layer 102, a gate insulating film 103, The wiring layer 121 , the interlayer insulating film 131 , the wiring layer 122 , the interlayer insulating film 132 , the wiring layer 123 , the interlayer insulating film 133 , and the pixel electrode 105 . The semiconductor layer 102 is the first first conductor layer from the substrate 101 side, and has a channel region 102a and high-concentration impurity regions 102b and 102c. The gate insulating film 103 is a first insulating film from the substrate 101 side. The wiring l...

Embodiment approach 2

[0070] Figure 5 It is a schematic diagram which shows the substrate for display devices of Embodiment 2, (a) is a plan view, (b) is a sectional view along the line X2-Y2 in (a).

[0071] The display device substrate 200 of Embodiment 2 is a display device substrate suitable for a display device such as a liquid crystal display device. Such as Figure 5 As shown in (a) and (b), the substrate 200 for a display device has a structure in which semiconductor layers 202n, 202p, and a gate insulating film are stacked sequentially from the substrate 201 side on one main surface side of the substrate 201. 203 , wiring layer 221 , interlayer insulating film 231 , interlayer insulating film 232 , wiring layer 223 , interlayer insulating film 233 and wiring layer 224 . The semiconductor layers 202n and 202p are the first first conductor layers from the substrate 201 side. The gate insulating film 203 is a first insulating film from the substrate 201 side. The wiring layer 221 is a se...

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Abstract

A multilayer wiring, a semiconductor device, a substrate for display and a display, in which the area for placing a wiring layer can be narrowed while suppressing deterioration of characteristics resulting from the parasitic capacitance. The multilayer wiring comprises, from the substrate side, a first conductor located on the (n+1)th conductor layer, a second conductor located on the (n+2)th conductor layer and connected electrically with a conductor located below the (n+1)th conductor layer at least through a first contact hole in the (n+1)th insulating film directly under the (n+2)th conductor layer such that the second conductor does not overlap the first conductor in plan view of the major surface of the substrate, and a third conductor located on the (n+3)th conductor layer and connected electrically with the second conductor through a second contact hole in the (n+2)th insulating film directly under the (n+3)th conductor layer in plan view of the major surface of the substrate and placed on the first conductor side from the second contact hole in the plan view of the major surface of the substrate.

Description

technical field [0001] The present invention relates to multilayer wiring, a semiconductor device, a substrate for a display device, and a display device. More specifically, it relates to a multilayer wiring suitable for mobile devices such as mobile phones, a semiconductor device, a substrate for a display device, and a display device. Background technique [0002] In recent years, portable electronic devices such as mobile phones and PDAs equipped with display devices such as liquid crystal display devices and organic electroluminescence display devices have been increasingly required to be smaller and lighter. Along with this, developments are being made to achieve miniaturization of non-aperture portions, that is, narrower borders, in substrates for display devices included in display devices. [0003] In addition, in order to achieve thinning and cost reduction, there is a tendency to increase the number of display devices provided with all-monolithic display device su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/3205H01L29/786G02F1/1368H01L23/52
CPCH01L23/528G02F1/136286H01L27/1214G02F2001/13606H01L2924/12044G02F2001/13629H01L2924/0002H01L27/124H01L27/1248G02F1/13606G02F1/13629H01L2924/00
Inventor 森胁弘幸
Owner SHARP KK
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