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Wire pattern and method for monitoring adhesion deviation of film material

A film material and attachment technology, applied in nonlinear optics, instruments, optics, etc., can solve problems such as low efficiency and inability to grasp accuracy

Inactive Publication Date: 2012-07-04
CHUNGHWA PICTURE TUBES LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The main purpose of the present invention is to provide a special wire pattern in the pad area and a method for monitoring the deviation of film material attachment by using the wire pattern, so as to improve the efficiency and accuracy of measuring the deviation of film material deviation and solve the problem of The traditional method of measuring the attachment deviation of the film material has the problem of low efficiency and inability to grasp the accuracy due to the time-consuming procedure

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  • Wire pattern and method for monitoring adhesion deviation of film material
  • Wire pattern and method for monitoring adhesion deviation of film material
  • Wire pattern and method for monitoring adhesion deviation of film material

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Embodiment Construction

[0035] Please refer to Figure 7 , Figure 7 It is a schematic diagram of an LCD panel 50 applying the wire pattern of the pad area of ​​the present invention. The LCD panel 50 includes an array substrate 52 and a color filter substrate 54. The area of ​​the array substrate 52 not covered by the color filter substrate 54 is defined as a non-display area 56, and a plurality of pads are arranged on the non-display area 56. District 58 ( Figure 7Only the pad area on the side of the signal line is drawn in the figure), which is used to set the terminal portion to be electrically connected with an external circuit to drive the LCD panel 50 .

[0036] Please refer to Figure 8 , Figure 8 It is an enlarged schematic view of a wire pattern 60 in a pad area 58 of the present invention. The conductor pattern 60 includes a plurality of terminal portions 62 parallel to the Y direction shown in the figure, and arranged side by side along the X direction shown in the figure. Each te...

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Abstract

The invention provides a wire pattern in a connecting pad area, which comprises a plurality of terminal parts which are arranged in parallel in the connecting pad area, wherein each terminal part comprises an open part and a lead part; each terminal part has at least one open part side edge; and the lead parts are connected to the open part side edges correspondingly. The positions of the lead parts relative to the corresponding open parts vary with the configuration positions of the terminal parts in the connecting pad area. The invention also discloses a method for monitoring the adhesion deviation of a film material, which comprises: providing a film material with a plurality of conductive patterns on surface; and providing a target area on the surface of which the film material is to be adhered. In the invention, the efficiency and accurate of the measurement of the adhesion deviation of the film material, and the problems of low efficiency and uncontrollable precision of the conventional film material adhesion deviation measuring method adopting a time-consuming process are solved.

Description

technical field [0001] The invention relates to a wire pattern in a pad area and a method for monitoring the adhesion deviation of a film material, in particular to a wire pattern in a pad area and a monitoring sticker that can be used as a reference standard for monitoring the adhesion deviation of a film material. method with deviation. Background technique [0002] In general liquid crystal display panel (liquid crystal display, LCD) manufacturing process, an array substrate and a color filter substrate are produced separately first, and the array substrate is manufactured by several semiconductor processes such as thin film deposition, lithography and etching. , to make an array of thin film transistors, and the color filter substrate is to make color filters arranged in arrays corresponding to the thin film transistors on the substrate. After the array substrate and the color filter substrate are manufactured respectively, they are bonded together and cut into pieces. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1345
Inventor 邓印翔许汉东
Owner CHUNGHWA PICTURE TUBES LTD