Imaging module

Abstract

Provided is an imaging module, which can be reduced in weight so that it can be stably held in an external structure and can acquire a highly precise image. The imaging module (10) comprises an imaging substrate (6) mounting an imaging element thereon, a resin holder (4) including a substrate fixing portion (4a) fixing the imaging substrate (6), a lens supporting cylinder (4b) supporting a lens (1) therein, and holding portions (4c) protruding from the substrate fixing portion (4a) to an object side and having through holes (4d) to be held by an external structure, a fixing member (5) made ofa metal and arranged on the object side of the substrate fixing portion (4a) of the holder (4), and a holding plate member (3) made of a metal and including a fixed area fixed on and electrically connected with the fixing member (5), and holding portion adjoining regions (3b) having through holes (3c) overlapping the peripheries of the through holes (4d) of the holding portions (4c) and leading to the through holes (4d). The imaging module (10) can be reduced in weight so that it can be stably held in the external structure and can acquire a highly precise image.

Description

technical field [0001] The present invention relates to an imaging module using an imaging element such as a semiconductor image sensor. Background technique [0002] For example, Patent Document 1 discloses, as a compact imaging module, an imaging module that uses a semiconductor image sensor such as a CCD image sensor or a CMOS image sensor as an imaging element that converts object light into an electrical signal, and has an imaging substrate and a metal The imaging substrate is mounted with an imaging element, and the metallic bracket is provided with a lens support cylinder that supports a lens that collects light from an object. [0003] In addition, in the imaging module described in Patent Document 1, the imaging board and the holder are fixed by screwing. Specifically, a through hole through which the screw passes is provided on the imaging substrate, and a screw screw hole is provided on the bracket, and the screw is inserted into the through hole of the imaging s...

AI Technical Summary

Problems solved by technology

[0008] However, in the above-mentioned camera module, since the frame, which is a large part among the constituent parts, is made of metal, there is a problem that there is a limit in terms of weight reduction.

[0009] In addition, if only the bracket is made of resin, there is a problem that the shape of the through hole is easily deformed when the support pin for holding on the external structure such as the protective case is inserted into the through hole, so that the external structure Body and stent retention becomes unstable

In addition, there is also a problem that high-precision images cannot be obtained because one of the functions of the metal bracket is to shield electromagnetic interference from the subject side.

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