Method for protecting chip in chip thinning process

Abstract

The invention discloses a method for protecting chip in chip thinning process. A 3193 type or 319Y type hot stripping foil, a vacuum pad and a stripping heater are adopted, the 3193 type or 319Y type hot stripping foil is used for covering the front of silicon chip product, so as to carry out the chip thinning process, after chip thinning is qualified, and heating and stripping are carried out. The method of the invention is reasonable and simple, and chip front protection effect in the chip thinning process is good. The 3193 type or 319Y type hot stripping foil adopts hot foaming stripping adhesive, thus adhesive strength at normal temperature is extremely high, when temperature is increased to 135-145 DEG C, adhesive is foamed, stripping resistance is greatly reduced, so that stripping is easy, membrane can not be torn or remain on the surface of the silicon chip product, and meanwhile no adhesive residue is remained, operation is convenient, production material cost is saved, and product quality and working efficiency are greatly improved.

Description

technical field [0001] The invention relates to a chip protection method in the chip thinning process in the manufacturing process of semiconductor silicon devices and integrated circuits. Background technique [0002] The manufacturing process of semiconductor silicon devices and integrated circuit dies must have a thinning process for finished wafers. [0003] Due to the electrical characteristic requirements of various devices, the substrate is generally required to be thin. And these products are mass-produced on large wafers (such as 4 o'clock, 5 o'clock, 6 o'clock, etc.), and the thin wafers are very easy to be broken during processing, and the thinner the more fragile, so the process must use The thick sheet is processed and transferred until the product is made, and then the back side is thinned to the required thickness by the thinning process, and then the subsequent process is carried out until the semiconductor chip is completed. [0004] The thinning process i...

AI Technical Summary

Problems solved by technology

But the disadvantage is that it is more troublesome to remove this kind of mucous membrane

Generally speaking, the firmer the paste, the harder it is to remove it. When removing the film, it is more manual, the film is easy to be torn, and the more residual glue is, it is difficult to remove it, which will affect the product quality and production efficiency.