Method for protecting chip in chip thinning process

A chip and process technology, applied in the field of chip protection, can solve problems such as affecting product quality and production efficiency, troublesome removal of mucous membranes, and easy to tear the film. Effect

Active Publication Date: 2011-03-02
扬州晶新微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the disadvantage is that it is more troublesome to remove this kind of mucous membrane
Generally speaking, the firmer the paste, the harder it is to remove it. When removing the

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The product silicon chip selected in this embodiment is a gold-backed transistor chip, and the protective film is a 319Y type thermal peeling film produced by Nitto Denko Co., Ltd. The following process steps are used:

[0029] 1. The operator wears clean white gauze gloves, and uses Teflon tweezers to carefully pick up the transistor back gold chip to be filmed from the frame (or from other places where the transistor back gold chip is placed), with the front (tube core product) facing upward Place on vacuum cups.

[0030] 2. Turn on the vacuum, set the pressure of the vacuum suction cup at 0.4Mpa-2.0Mpa, make the transistor back gold silicon wafer to be filmed adsorb on the suction cup, pull the 319Y type thermal peeling film from the roll film to protect the silicon wafer covering the entire product On the front side (die product), use a sponge to initially compact the heat-peeling film and the surface of the product silicon wafer, and then use a blade to cut off th...

Embodiment 2

[0035] The product silicon chip selected in this embodiment is a gold-backed integrated circuit chip, and the protective film is a 3193 type thermal peeling film produced by Nitto Denko Co., Ltd. The following process steps are used:

[0036] 1. The operator wears clean white gauze gloves, and uses Teflon tweezers to carefully pick up the IC back-gold chip to be filmed from the box (or from other places where the IC back-gold chip is placed), and the front (die product) Place upwards on vacuum suction cups.

[0037] 2. Turn on the vacuum, set the pressure of the vacuum suction cup at 0.4Mpa-2.0Mpa, so that the silicon wafer of the product to be laminated is adsorbed on the suction cup, and pull the 3193 type thermal peeling film from the roll film to protect the front of the entire product silicon wafer, use Sponge wipes the thermal release film and the surface of the product silicon wafer for initial compaction, and then uses a blade to cut the heat release film along the ed...

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PUM

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Abstract

The invention discloses a method for protecting chip in chip thinning process. A 3193 type or 319Y type hot stripping foil, a vacuum pad and a stripping heater are adopted, the 3193 type or 319Y type hot stripping foil is used for covering the front of silicon chip product, so as to carry out the chip thinning process, after chip thinning is qualified, and heating and stripping are carried out. The method of the invention is reasonable and simple, and chip front protection effect in the chip thinning process is good. The 3193 type or 319Y type hot stripping foil adopts hot foaming stripping adhesive, thus adhesive strength at normal temperature is extremely high, when temperature is increased to 135-145 DEG C, adhesive is foamed, stripping resistance is greatly reduced, so that stripping is easy, membrane can not be torn or remain on the surface of the silicon chip product, and meanwhile no adhesive residue is remained, operation is convenient, production material cost is saved, and product quality and working efficiency are greatly improved.

Description

technical field [0001] The invention relates to a chip protection method in the chip thinning process in the manufacturing process of semiconductor silicon devices and integrated circuits. Background technique [0002] The manufacturing process of semiconductor silicon devices and integrated circuit dies must have a thinning process for finished wafers. [0003] Due to the electrical characteristic requirements of various devices, the substrate is generally required to be thin. And these products are mass-produced on large wafers (such as 4 o'clock, 5 o'clock, 6 o'clock, etc.), and the thin wafers are very easy to be broken during processing, and the thinner the more fragile, so the process must use The thick sheet is processed and transferred until the product is made, and then the back side is thinned to the required thickness by the thinning process, and then the subsequent process is carried out until the semiconductor chip is completed. [0004] The thinning process i...

Claims

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Application Information

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IPC IPC(8): H01L21/02H01L21/304
Inventor 张俊
Owner 扬州晶新微电子有限公司
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