Microelectronic device and manufacturing method, microelectromechanical packaging structure and packaging method
A technology of microelectronic devices and microelectromechanical structures, applied in the direction of microstructure technology, microstructure devices, generators/motors, etc., can solve the problems of general products and methods without suitable structures and methods, inconvenience, etc.
Active Publication Date: 2014-10-22
PIXART IMAGING INC
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Problems solved by technology
[0005] It can be seen that the above-mentioned existing microelectronic devices and manufacturing methods obviously still have inconvenience and defects in product structure, manufacturing method and use, and need to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve
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[0072] In order to further explain the technical means and effects that the present invention takes to achieve the intended purpose of the invention, the microelectronic device and manufacturing method, micro-electromechanical packaging structure and packaging method proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. The specific implementation, structure, manufacturing method, steps, features and effects thereof are described in detail below.
[0073] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. For the convenience of description, in the following embodiments, the same elements are denoted by the same numbers.
[0074] Figure 1A to Figure 1E A schematic cross-sectional view of the manufacturing process of the microelec...
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The invention relates to a microelectronic device and a manufacturing method thereof, and a micro electromechanical packaging structure and a packaging method thereof. The manufacturing method of the microelectronic device comprises the following steps of: forming a semiconductor element in a complementary metal oxide semiconductor (CMOS) circuit area of a substrate; forming a plurality of metal layers, a plurality of contact windows, a plurality of oxide layers and a first protective layer on the substrate, wherein the first protective layer is positioned on at least one oxide layer, the metal layers and the oxide layers are staggered and laminated, and the contact windows are formed in the oxide layers and connected to the corresponding metal layers, so that a micro electromechanical structure is formed on a micro electromechanical area of the substrate, and an interconnection structure is formed on the CMOS circuit area; forming a second protective layer on the interconnection structure; and removing part of oxide layers from the micro electromechanical area to ensure that the micro electromechanical structure is partially suspended above the substrate. A CMOS circuit and a micro electromechanical element can be integrated into the same process to be finished, so the production cost of the microelectronic device can be reduced. In addition, the invention provides the microelectronic device, and the micro electromechanical packaging structure and the packaging method thereof.
Description
technical field [0001] The invention relates to a microelectronic device and a manufacturing method, a microelectromechanical packaging structure and a packaging method, and in particular to a microelectronic device, a manufacturing method, a microelectromechanical packaging structure and a packaging method with low production costs. Background technique [0002] The development of Micro Electromechanical System (MEMS) technology has opened up a new technical field and industry, which has been widely used in various microelectronic devices with dual characteristics of electronics and mechanics, such as pressure sensors, accelerators with miniature microphone etc. [0003] In conventional microelectronic devices including MEMS components, the internal semiconductor circuits are usually fabricated by CMOS technology, and the MEMS components are additionally fabricated by micromachining. However, due to the tedious and difficult manufacturing process, the above-mentioned micro...
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IPC IPC(8): B81C1/00B81C3/00B81B7/02B81B7/00
Inventor 徐新惠李昇达王传蔚
Owner PIXART IMAGING INC