Manufacturing method of sandwich plate

A production method and multi-layer board technology, which is applied in the field of copper clad laminates and printed circuit boards, can solve the problems of large glue flow on the pressing board, and achieve the effect of avoiding high cost, low energy consumption and low cost

Active Publication Date: 2011-04-13
GUANGDONG SHENGYI SCI TECH
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for making multi-layer boards, which uses low-cured insulation-reinforced boards to replace prepregs for multi-layer board production, which can

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  • Manufacturing method of sandwich plate
  • Manufacturing method of sandwich plate
  • Manufacturing method of sandwich plate

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[0025] In order to further illustrate the technical means adopted by the present invention and its effects, a detailed description is given below in conjunction with the preferred embodiments of the present invention and the accompanying drawings.

[0026] like figure 1 As shown, the present invention provides a method for manufacturing a multi-layer board, which comprises the following steps:

[0027] Step 1. Provide several prepreg sheets, match the prepreg sheets according to the required thickness, and cover both sides with release film. As an optional embodiment of the present invention, the prepreg can be a 7628 prepreg impregnated with FR-4 resin mixture.

[0028] Step 2. Heat and pressurize the prepreg with the release film on both sides through a press. In step 2, the prepreg may be heated and pressurized by a vacuum press.

[0029] Step 3. After the prepreg has passed through a high temperature melting state and begins to undergo a solidification reaction, the hea...

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Abstract

The invention relates to a manufacturing method of a sandwich plate, comprising the following steps of: 1, providing a plurality of prepregs, collocating the prepregs according to required thicknesses, and coating release films on double surfaces; 2, heating and pressing the prepregs with the double surfaces coated with the release films through a pressing machine; 3, when the prepregs are in high-temperature molten states and start to carry out curing reaction, stop heating before materials are completely cured, wherein the prepregs already reach a procuring stage at the time so as to become insulating reinforcing plates with lower curing degree; and 4, substituting the insulating reinforcing plates with lower curing degree for the prepregs to be used for manufacturing the sandwich plate so as to manufacture the sandwich plate with uniform interlaminar thickness. The invention substitutes the insulating reinforcing plates with lower curing degree for the prepregs to be used for producing the sandwich plate, thereby not only solving the problems of large gummosis of press plates and the like and having good interface bonding force, but also fitting to the low-carbon economic concepts, i.e. low cost, low energy consumption and low pollution.

Description

technical field [0001] The present invention relates to the fields of copper clad laminates (CCL) and printed circuit boards (PCB), in particular to a method of manufacturing multi-layer boards by applying insulation-reinforced boards with a low curing state between prepreg and cured copper clad laminates (or insulating boards). method. Background technique [0002] With the continuous development of "thin, light and small" electronic products, high-density interconnect (HDI) multilayer boards continue to pursue thinning, making printed circuit boards continue to develop in the direction of high-layer and high-density circuit distribution. The impedance design in the multilayer board determines the thickness of the dielectric layer of the multilayer board, and the dielectric layer between the core boards is realized through the combination of prepregs. When multiple prepreg pressing plates are used at the same time, it is easy to have many problems such as large flow of glu...

Claims

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Application Information

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IPC IPC(8): B32B37/06B32B37/10B32B15/08
Inventor 张君宝吴小连方东炜
Owner GUANGDONG SHENGYI SCI TECH
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