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Method for packaging photoelectric device

A packaging method and technology for optoelectronic devices, applied in electrical components, semiconductor devices, circuits, etc., can solve the problems of difficult to process protective glue, difficult control, low yield rate, etc., to save investment in special equipment, reduce production costs, and simplify The effect of management and control

Inactive Publication Date: 2011-04-13
上海芯哲微电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] As far as the existing process is concerned, it is difficult to process protective glue with good light transmittance with the current equipment and materials. In this process, the control is difficult, the cost is high, and the yield rate is very low.

Method used

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  • Method for packaging photoelectric device
  • Method for packaging photoelectric device
  • Method for packaging photoelectric device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Please see attached Figure 1-6 Shown, a kind of optoelectronic device packaging method, it comprises the following steps:

[0029] Step 1, fixing the chip 2 on the metal frame 3 with an adhesive 1, the adhesive adopts epoxy resin material;

[0030] Step 2, connect the chip 2 to the pin 5 on the metal frame 3 through the gold wire 4, and use the gold wire to connect the chip 2 to the pin 5 on the metal frame 3 by ultrasonic welding;

[0031] Step 3, apply the sealant 6 on the bayonet joint in the preformed outer frame 7 and the joint between the upper cover 8 and the preformed outer frame 7;

[0032] Step 4, install the upper cover 8 downwards on the preformed outer frame 7 through the sealant 6;

[0033] Step 5. Paste a layer of sealing protection film 9 on the upper surface of the upper cover 8. The sealing protection film 9 is made of a material resistant to high temperature and corrosion. Preferably, the sealing protection film 9 is made of polyimide material.

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PUM

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Abstract

The invention discloses a method for packaging a photoelectric device, comprising the following steps of: fixing a chip on a metal frame by using an adhesive; connecting the chip with a pin on the metal frame by using gold wires; coating a sealant on a bayonet in a preformed outer frame as well as the joint of an upper cover and the preformed outer frame; pushing the upper cover and then installing the upper cover on the preformed outer frame by using the sealant; and sticking one layer of sealing protective film on the upper surface of the upper cover. By adopting a non-chip surface direct-glue dispersion protecting mode in stead of the traditional chip surface direct-glue dispersion protecting mode, the method for packaging the photoelectric device simplifies management and control on the whole process, greatly improves the yield of products and reduces the production cost.

Description

technical field [0001] The invention relates to a photoelectric device packaging method. Background technique [0002] In the field of integrated circuits, the chip packaging process is already a relatively complete and mature technology, which can generally be divided into processes such as chip loading, bonding, dispensing, capping, and film attachment. But for optoelectronic devices, the existing packaging technology is not the most suitable. The difference between optoelectronic device chip packaging and ordinary chip packaging is that there is a photosensitive functional area on the optoelectronic device chip, and the packaging material needs to have good light transmission. That is to say, the protective glue outside the optoelectronic device chip must have good light transmittance, and the shape, flatness, thickness, and processing accuracy of the protective glue layer are also highly required. [0003] A common method for chip packaging of optoelectronic devices in...

Claims

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Application Information

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IPC IPC(8): H01L31/18
CPCY02P70/50
Inventor 陈金华
Owner 上海芯哲微电子科技股份有限公司