Image sensing module and capsulation method thereof
A technology of image sensing and packaging methods, which is applied in the direction of radiation control devices, electrical components, and electric solid devices, and can solve problems such as the loss of pass rate, affecting the overall pass rate of products, and errors
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[0027] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:
[0028] Cooperate with reference figure 1 , is a cross-sectional view of the first embodiment of the thin image sensing module of the present invention. The image sensing module includes an image sensing unit 100 and a lens group 200 . The image sensing unit 100 is a core component of a digital image product, a semiconductor component mainly used to convert an optical image into an electronic signal, and is applied to a digital camera or other image devices.
[0029] The image sensing unit 100 includes a substrate 102, an image sensing chip 104 disposed on the substrate 102, and a plurality of metal leads straddling the image sensing chip 104 and the substrate 102 for electrical connection. 106.
[0030] The image sensing unit 100 also includes a transparent cover 108 on the image sensing chip 104, the transparent cover 108 ...
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