Solder mask screen printing method

A technology of screen printing and solder masking, which is applied in the secondary treatment of printed circuits, coating of non-metallic protective layers, etc. Save time and improve efficiency

Inactive Publication Date: 2011-04-20
深圳喜珍科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many problems in the application of the existing anti-soldering methods, mainly in the long operation time and many hidden dangers of quality. For example, in order to avoid false copper exposure in the plug holes, the existing anti-soldering methods use aluminum sheet plug holes, and use aluminum sheet It is difficult to make the saturation of the plug hole reach 100%, and the plug hole halo is easy to appear, which is not allowed for customers who have strict requirements on the appearance of the product; in addition, the existing solder mask method directly uses the white screen screen printing board surface, which is easy to cause Bad problems such as ink hole

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] In this embodiment, the anti-soldering treatment is carried out on the audio-visual board with a plate thickness of 1.6mm. The process flow is: production of dot screen → pretreatment of copper plate → screen printing of dot screen on the first side → silk screen printing of dot screen on the second side → standing → Pre-baking → resting → alignment → exposure → resting → development → post-baking.

[0017] The specific operation steps are as follows: (1) Make the stop net, the length and short side coefficients of the stop net are both: 0.9999, all plug-in holes: increase 4mil on one side, the via hole with the window: the stop point with the drilling diameter 2 , Squeegee speed: 4m / min, the rest of the screen printing operation adopts the routine operation of those skilled in the art; (4) screen printing the second side of the block screen, the operation of the second side screen printing is the same as that of step (3) Screen printing on the first side, then screen pr...

Embodiment 2

[0024] In this embodiment, the high-frequency signal board with a plate thickness of 1.0mm is subjected to anti-soldering treatment. The operation process is: dot screen production → copper plate pretreatment → screen printing of the first dot screen → screen printing of the second dot screen → static Set → pre-baking → static → alignment → exposure → static → development → post-baking.

[0025] The specific operation steps are as follows: (1) Make the stop net, the length and short side coefficients of the stop net are both: 0.9999, all plug-in holes: increase 4mil on one side, the via hole with the window: the stop point with the drilling diameter 2 , Squeegee speed: 4m / min, the rest of the screen printing operations adopt the routine operations of those skilled in the art; (4) Block the second side of the screen printing, the second side of the screen printing operation is the same as the first step (3) Block the screen printing on one side, then block the screen printing on...

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PUM

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Abstract

The invention relates to a solder mask screen printing method. The method comprises the following steps: manufacturing a point blocking screen; performing pre-treatment on a copper plate; screen-printing the first surface and the second surface of the point blocking screen; standing and pre-roasting in turn; standing again; and performing successive alignment, exposure, standing, development and post-roasting processes in turn, wherein the screen printing of the first surface and the second surface of the point blocking screen are performed by two screen printing machines, meanwhile, a copperplate hole plugging process is performed during the printing. In the screen printing process, the additive amount of solder mask ink is controlled within 15-25 ml / kg; an ink scraper is adjusted into a shoveling knife, the angle of the ink scraper is set as 15-25 degrees, the angle of an ink return knife is set as 35-45 degrees, the pressure of the ink scraper and the ink return knife is set as 6-8 kg / cm<2>, and the scraper speed is 3-5 m / minutes. The method is used for manufacturing a circuit board and can improve the solder mark effect relatively well, simplify the operation steps remarkably, save the time and lower the cost.

Description

technical field [0001] The invention relates to the technical field of PCB anti-soldering technology, in particular to a anti-soldering screen printing method capable of effectively preventing ink from entering holes. Background technique [0002] In the circuit board production process, after the production of the outer layer circuit is completed, the outer layer circuit must be protected by solder protection to prevent the outer layer circuit from oxidation or welding short circuit. In the past, the common method of solder protection was to first copper the circuit board Surface pretreatment, and then use screen printing to print a layer of solder resist ink on the circuit board, and then undergo pre-baking, exposure, development and post-baking in sequence to achieve solder resist treatment on the circuit board. The anti-soldering treatment can facilitate the welding process of components, save solder and prevent short circuits, protect copper wires and prevent parts from...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
Inventor 贺波杨展仁张涛
Owner 深圳喜珍科技有限公司
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