Workpiece dividing method
A technology for workpieces and wafers, applied in the field of division processing, can solve the problems of inability to properly cut the bonding film, difficult to bond the film, and forming a modified area alone.
Inactive Publication Date: 2011-04-27
DISCO CORP
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Problems solved by technology
[0006] However, in the case of using an adhesive film with a thickness greater than a certain thickness, the adhesive film may not be properly cut if only the impact force at the time of wafer cutting in the expansion step is used.
In addition, since there is no dividing line on the adhesive film, it is difficult to individually form the modified region on the adhesive film.
Method used
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Embodiment Construction
[0023] figure 1 and figure 2 The wafer W shown is configured such that functional elements D are formed in the area of the surface W1 divided by the planned dividing line L, and an adhesive film 1 is attached to the back surface W2, which is the non-element forming surface of the wafer W, and the wafer W and the adhesive The bonding film 1 forms the workpiece 2 . The surface of the adhesive film 1 attached to the back surface W2 of the wafer W is the surface 1a. The wafer W is formed of, for example, a semiconductor wafer such as a silicon wafer. In addition, as the adhesive film 1, for example, a film called DAF (Die Attach Film) is used.
[0024] The adhesive film 1 side of the workpiece 2 is bonded to the adhesive surface of the expansion tape T. A ring-shaped frame F is attached to the outer peripheral portion of the expansion tape T, and the expansion tape T attached to the ring-shaped frame F is in a state of plugging the opening of the ring frame, and the adhesiv...
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A workpiece dividing method is provided. When wafers with adhesive films stuck are divided, even if the adhesive films have a thickness higher than a certain level, the adhesive films can be properly divided along predetermined dividing lines of the wafers. An expansion tape is stuck to an adhesive film side of a workpiece in a state where an adhesive film is stuck to the rear surface of a wafer (W). Positions of predetermined dividing lines (L) on the surface of the wafer (W) are detected. On the basis of information on the detected predetermined dividing lines (L), a laser beam irradiating and transmitting the wafer (W) from the surface side of the wafer (W) is focused on and directed to the surface of or in the inside of the adhesive film to form modified areas on the surface of or in the inside of the adhesive film. On the basis of information on the detected predetermined dividing lines (L), a laser beam irradiating and transmitting the wafer (W) from the surface side of the wafer (W) is focused on and directed to the inside of the wafer (W) to form modified areas in the inside of the wafer (W). The expansion tape is expanded to divide the workpiece along the predetermined dividing lines (L) with the modified areas as start points.
Description
technical field [0001] The present invention relates to a dividing processing method for dividing and processing a workpiece having an adhesive film attached to a wafer such as a semiconductor wafer. Background technique [0002] Conventionally, silver paste has been mainly used for bonding semiconductor elements and semiconductor element mounting support members. However, with recent downsizing and higher performance of semiconductor elements, the supporting member for mounting a semiconductor element to be used is also required to be downsized and finer. In response to this requirement, when silver paste is used, there are problems in wire bonding due to exposure and / or inclination of the semiconductor element, difficulty in controlling the film thickness of the bonded part, and generation of voids in the bonded part. The request cannot be met. Therefore, in recent years, an adhesive film has been used instead of the silver paste in order to meet the above demands. [0...
Claims
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IPC IPC(8): H01L21/301
CPCH01L21/67092H01L21/78
Inventor 中村胜
Owner DISCO CORP