Heat sink of notebook computer
A notebook computer and cooling device technology, applied in the direction of electrical digital data processing, instruments, digital data processing components, etc., can solve the problems of poor heat conduction rate, the heat dissipation of the cooling device cannot adapt to the speed of heat production, etc., and achieve a rapid increase in efficiency , Good cooling effect
Inactive Publication Date: 2011-05-04
刘昱彤
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Problems solved by technology
The cooling device of the existing notebook computer is designed with the combined structure of its heat sink and fan. Although it has the function of heat dissipation, the central processing unit of this notebook computer generates high temperature and conducts it to the heat sink, and then conducts it to each heat sink completely by itself. On the heat dissipation fins, due to the poor heat conduction rate of solids, and the increase in the processing speed of the central processor of the notebook computer, the high temperature generated by the work is relatively increased, so the heat dissipation device is limited by the space of the computer case, and the heat dissipation of the heat dissipation device cannot rate of adaptation to heat production
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[0011] The present invention will be further described below in conjunction with accompanying drawing.
[0012] Such as figure 1 and figure 2 As shown, a heat dissipation device for a notebook computer includes a heat dissipation plate 10 and a heat conductor 20, the heat dissipation plate 10 includes a placement groove 11, an extension groove 12 and an assembly hole 14, the heat conductor 20 includes a body 21 and 22 heat dissipation pipes, and the heat dissipation plate 10 There is a placement groove 11 in the center of the top surface, and several extending grooves 12 extending radially and horizontally are arranged around the placement groove 11. The top of the cooling plate 10 is provided with an array of connecting holes 14, and the heat conductor 20 is correspondingly arranged in the body 21 in the placement groove 11. The body 21 is provided with a number of cooling pipes 22 correspondingly arranged in the extension groove 12. One end of each cooling pipe 22 is conne...
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The invention discloses a heat sink of a notebook computer, belonging to the technical field of computer heat dissipation. The heat sink of the notebook computer comprises a heating panel and a heat carrier, wherein the heating panel comprises a resettlement groove, extension grooves and assembling holes; the heat carrier comprises a body and radiating pipes; the resettlement groove is arranged in the middle on the top of the radiating pipes; the periphery of the resettlement groove is provided with a plurality of horizontally extended extension grooves in a radial pattern; the top of the heating panel is provided with a plurality of assembling holes; the heat carrier corresponds to the body in the resettlement groove; the periphery of the body is provided withy a plurality of radiating pipes which are correspondingly arranged in the extension grooves; one end of each radiating pipe is communicated with the body, and the other end of the each radiating pipe is sealed; and heating carrier is filled with liquid refrigerants. The heat sink has the beneficial effects that by means of heat conduction efficiency for fast spread of gaseous refrigerants, the heat sink has preferable radiating effect, thus the heat conduction efficiency can be effectively and fast improved.
Description
technical field [0001] The invention relates to a heat dissipation device for a computer, in particular to a heat dissipation device for a notebook computer, and belongs to the technical field of computer heat dissipation. Background technique [0002] Notebook computers are light, thin, and easy to carry, and they are purchased and used by most people. Laptops gather most of the electronic components in a very small case, and the design of laptops is getting thinner and thinner, the calculation of the central processing unit is getting faster and faster, and the heat generated by high-speed computing power consumption is relatively higher. Therefore, The heat dissipation problem of the high temperature (especially the central processing unit) generated when the notebook computer works has always been one of the key projects of notebook computer research and development. It is currently used in notebook computers as a cooling device for the central processing unit. It mainl...
Claims
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IPC IPC(8): G06F1/20
Inventor 刘昱彤
Owner 刘昱彤