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Apparatus and method for attaching sheet

A sheet sticking device and bonding technology, applied in the manufacture of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of complicated pressure control and chip breakage, and achieve the effect of reducing the contact area and avoiding damage.

Active Publication Date: 2011-05-04
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since in the sheet sticking device of Patent Document 1, the pressure of the space on the lower surface side and the upper surface side of the rubber sheet is kept equal while the pressure is reduced, there is a problem that the pressure control becomes very difficult. complicated question
In addition, the wafer is a full-contact type, that is, the entire area of ​​the lower surface side is supported in a state of being in contact with the rubber sheet. When the pressure of the dicing sheet is pasted, it may cause damage such as wafer breakage

Method used

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  • Apparatus and method for attaching sheet
  • Apparatus and method for attaching sheet
  • Apparatus and method for attaching sheet

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Embodiment Construction

[0039] Below, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0040] figure 1 A schematic front view showing the sheet sticking device according to this embodiment, figure 2 shows the omitted figure 1 A schematic top view of a portion of . In these figures, the sheet sticking apparatus 10 includes: a table 11 for supporting a plate-shaped member as an adherend, that is, a substantially circular wafer W; And form decompression chamber C in it; And supply mechanism 15, it under the state that this cabinet 14 is opened, the adhesive sheet S of pressure-sensitive adhesiveness is supplied to the position facing adhesive face, and this bonding The surface is the upper surface of the wafer W. Here, if figure 2 As shown, the adhesive sheet S adopts a width dimension that does not block the decompression chamber C up and down. When the adhesive sheet S is supplied to the position facing the adhesive surface of the w...

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Abstract

A sheet attaching apparatus (10) is provided with an openable / closable case (14), which stores a table (11) supporting a semiconductor wafer (W) and forms a depressurization chamber (C) inside; a supply means (15), which supplies an adhesive sheet (S) to a position facing the semiconductor wafer (W); and a sandwiching means (29), which is arranged in the case (14) at a position facing the table (11). The sandwiching means (29) sandwiches only the outer circumference section of the semiconductor wafer (W) with the adhesive sheet (S) by interacting with the table (11) in a state where the case (14) is closed and the single depressurization chamber (C) is formed. Then, by stopping depressurization of the depressurization chamber (C), the adhesive sheet (S) is attached to the semiconductor wafer (W).

Description

technical field [0001] The present invention relates to a sheet sticking device and a sticking method. More specifically, the present invention relates to a chip sticking device and a sticking method capable of sticking an adhesive sheet to an adherend under reduced pressure. Background technique [0002] Conventionally, an adhesive sheet is pasted on the circuit surface or the back surface of a semiconductor wafer (hereinafter simply referred to as "wafer"), and various processes such as back grinding and punching are performed. [0003] Patent Document 1 discloses a sticking device of the pressure-sensitive adhesive sheet. This device adopts a structure in which spaces are respectively formed on the lower surface side of the rubber sheet supporting the wafer and on the upper surface side of the die-cutting sheet arranged to face the wafer, and after depressurizing these spaces, the One of the spaces is opened to the atmosphere to stick the adhesive sheet to the wafer. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/67132
Inventor 中田斡
Owner LINTEC CORP