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Heat sink press-fitting device and hold-down clamp thereof

A technology of pressing device and heat sink, used in manufacturing tools, electrical components, printed circuit manufacturing, etc., can solve the problems of no space jig, prolonged operation time, etc., and achieve the effect of uniform pressure

Inactive Publication Date: 2011-05-11
WISTRON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, sometimes there may be a problem that there is no space for fixtures to be installed on the circuit board due to the relationship between the component configuration or multiple places at the same time. Bonded to electronic components on a circuit board by applying pressure so that they are glued to the electronic components
[0004] In addition, when heat sinks need to be installed in multiple places on the circuit board at the same time, if the work is done one by one, the work time will also be lengthened

Method used

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  • Heat sink press-fitting device and hold-down clamp thereof
  • Heat sink press-fitting device and hold-down clamp thereof
  • Heat sink press-fitting device and hold-down clamp thereof

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Embodiment Construction

[0064] The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings.

[0065] refer to figure 1 and figure 2 , a preferred embodiment of the heat sink pressing device of the present invention is used to apply pressure to a plurality of heat sinks 11 placed on a circuit board 12. In advance, apply glue on the heat sink 11, and then place the heat sink 11 Placed on the electronic component 13 of the circuit board 12, the heat sink 11 can be glued on the electronic component 13 through the pressure of the heat sink pressing device 1. In this embodiment, the heat sink pressing device 1 includes a Body 2, a plurality of pressing tools 3 arranged on the frame body.

[0066] The frame body 2 includes a fixing base 21 and a platform 22 . In this embodiment, the fixing base 21 and the platform 22 are plate-shaped, and the ...

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PUM

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Abstract

The invention discloses a heat sink press-fitting device which is used for applying a plurality of heat sinks onto a circuit board. The heat sink press-fitting device comprises a rack body and a plurality of hold-down clamps arranged on the rack body, wherein each hold-down clamp comprises a shaft part, a pressing head and a universal joint unit, the shaft part can be displaced and stretched elastically up and down, and the pressing head is connected to the bottom of the shaft part via the universal joint unit so as to be in contact with the heat sinks. Since the plurality of hold-down clampsare arranged, the plurality of heat sinks can be applied onto the circuit board simultaneously, thereby saving the operation time. The universal joint unit is arranged, so that the pressing head can automatically change an angle of inclination when being in contact with the heat sinks so as to be matched with the exterior surfaces of the heat sinks.

Description

technical field [0001] The invention relates to a heat sink pressing device, in particular to a heat sink pressing device for pressing a heat dissipation fin seat on a circuit board. Background technique [0002] Generally, to make the electronic components arranged on the circuit board have better heat dissipation performance, a heat dissipation seat with a heat dissipation fin structure, for example, is combined on the electronic component, and the heat dissipation seat is usually combined by means of jig pressing Fixing on the electronic components, such as those disclosed in US Pat. No. 6,865,082 and US Pat. No. 7,342,790, both use jigs or pressed parts to fix the heat sink on the electronic components. [0003] However, sometimes there may be a problem that there is no space for fixtures to be installed on the circuit board due to the relationship between the component configuration or multiple places at the same time. Bonded to electronic components on a circuit board...

Claims

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Application Information

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IPC IPC(8): B23P19/027H05K3/00
Inventor 李家铭杨受元
Owner WISTRON CORP
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