Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate processing system

A technology of processing system and substrate, which is applied in the direction of stone processing equipment, stone processing tools, manufacturing tools, etc., to achieve the effect of reliable removal

Active Publication Date: 2011-05-11
MITSUBOSHI DIAMOND IND CO LTD
View PDF4 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0034] As mentioned earlier, in the upper and lower substrate processing systems, the unit display panel is usually taken out by pulling it toward the upper side of the motherboard through the suction pad, so this problem arises

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate processing system
  • Substrate processing system
  • Substrate processing system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0090] A substrate processing system according to one embodiment of the present invention will be described with reference to the drawings. This substrate processing system is used in the manufacturing process of liquid crystal display panels to divide the mother board conveyed from the previous process into unit display panels, and take out the divided unit display panels one by one and transport them to the subsequent process.

[0091] (substrate processing system)

[0092] First, the overall configuration of the substrate processing system will be described.

[0093] figure 1 It is a perspective view showing the overall structure of the substrate processing system 1 according to one embodiment of the present invention. figure 2 yes figure 1 Shown to the perspective view of A (except for the stand 10 described later). image 3 It is a top view of the substrate processing system 1 (excluding the frame 11 and the support 14 described later). Figure 4 yes image 3 The...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided is a substrate processing system wherein a unit display panel arranged on a mother board in prescribed layout can be taken out without damaging a terminal region. The substrate processing system is provided with a scribe apparatus control section, which adjusts the depths of three scribe grooves formed at specified boundaries and controls an end material region at a position facing the terminal region to be left at specified positions, at the time of scribe-processing the specified boundaries which include the terminal region; a panel carry-out apparatus control section which takes out the unit display panel from the mother board in a prescribed preferential order so that the end material region is left at the specified position, at the time of taking out the unit display panel from the mother board; and an auxiliary break apparatus which cuts the end material region attached at the specified position by applying bending moment in a specified direction. Thus, separation is ensured even a terminal has a small width.

Description

technical field [0001] The present invention relates to a substrate processing system that divides a mother board (also referred to as a bonded substrate, bonded mother board) formed with a plurality of unit display panels, and takes out the unit display panels one by one. Specifically, the substrate processing system of the present invention is used in manufacturing processes such as liquid crystal display panels. Background technique [0002] Motherboards for manufacturing liquid crystal display panels consist of a first substrate (also referred to as a CF side substrate) on the side on which a plurality of color filters are patterned, and a substrate on which a plurality of TFTs and terminal regions are patterned. The second substrate on one side (also referred to as a TFT-side substrate) is bonded via a sealing member in which liquid crystal is sealed. At this time, the second substrate is pasted so that the surface of the substrate on which the TFTs and terminal region...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G02F1/13B28D5/00C03B33/03G02F1/1333G09F9/00
CPCB28D1/226B28D5/0011B65G2249/04C03B33/03C03B33/033C03B33/07C03B33/105
Inventor 高松生芳前川和哉
Owner MITSUBOSHI DIAMOND IND CO LTD