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Transfer film structure

A transfer film and hardening film technology, applied in special decorative structures, printing, decorative art, etc., can solve the problems of ink pattern damage, ink layer damage, easy downward penetration, etc., to enhance structural strength and improve yield , the effect of preventing damage

Inactive Publication Date: 2011-05-18
琨诘电子(昆山)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practical application, in the transfer film structure 10, the glue on the adhesive film layer 15 can easily seep downward into the decorative pattern layer 14, causing the ink pattern to be damaged and become a defective product.
If the defective transfer film is not detected and rejected, it will further flow into the back-end process, which will lead to more material loss
Moreover, if the injection molding conditions are changed, the structural strength of the transfer film will be insufficient, and the ink layer will easily be damaged.

Method used

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Embodiment Construction

[0020] The present invention will be specifically introduced below in conjunction with the accompanying drawings and specific embodiments.

[0021] The present invention proposes a transfer film structure, which aims to prevent the glue on the adhesive film layer from penetrating into the decorative pattern layer, so as to maintain the integrity of the ink decorative pattern and strengthen the structural strength of the film layer.

[0022] image 3 It is a schematic cross-sectional view of the first specific embodiment of the transfer film structure of the present invention. As shown in the figure, the transfer film structure 30 includes a base film layer 31, a release layer 32, a first cured film layer 33, a pattern layer 34, a second cured film layer 35 and an adhesive film layer 36 . Wherein, the release layer 32 is arranged on the upper surface of the base film layer 31, the first cured film layer 33 is arranged on the upper surface of the release layer 32, the pattern ...

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Abstract

The invention relates to a transfer film structure. The transfer film structure is characterized by comprising a base film layer, a release layer, a first hardened film layer, a decorative grain layer, a second hardened film layer and an adhesive film layer, wherein the release layer is arranged on the upper surface of the base film layer; the first hardened film layer is arranged on the upper surface of the release layer; the decorative grain layer is arranged on the upper surface of the first hardened film layer; the second hardened film layer is arranged on the upper surface of the decorative grain layer; and the adhesive film layer is arranged on the upper surface of the second hardened film layer. The second hardened film layer is arranged between the decorative grain layer and the adhesive film layer, and the second hardened film layer can block the glue of the adhesive film layer from permeating into the decorative grain layer to prevent ink patterns from being damaged and reinforce the structural strength of the film layer so as to achieve the effect of promoting the processing qualification rate of the transfer film.

Description

technical field [0001] The invention relates to a transfer film structure, in particular to a transfer film structure with a hardened film layer between a decorative pattern layer and an adhesive film layer. Background technique [0002] With the improvement of people's quality of life, the design of product appearance has become an important factor affecting consumer behavior, and products with unique compositional design and fashionable texture tend to be more favored. In-mold decoration (IMD, In-mold decoration) is a new type of plastic processing technology. It is to position the transfer film with decorative patterns printed on it in the mold of the injection machine, and to carry out the pattern while the plastic product is injection-molded. Transfer printing to complete the exterior decoration of the shell. Compared with traditional spraying, printing, electroplating and other processing methods, in-mold decoration technology can be used in mass production of product...

Claims

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Application Information

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IPC IPC(8): B41M5/00B32B27/06B44C5/04
Inventor 曾水泉
Owner 琨诘电子(昆山)有限公司
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