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Diaphragm and silicon capacitor microphone comprising same

A silicon condenser microphone and vibration part technology, applied in the field of silicon condenser microphones, can solve the problems of inability to release the stress gradient, low buckling strength of the diaphragm, and high degree of challenge, and achieve the effect of reducing the challenge, optimizing the damping of the diaphragm, and improving the sensitivity

Inactive Publication Date: 2011-05-18
AAC ACOUSTIC TECH (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The stress gradient generated by the structural layer stress on the diaphragm cannot be released, the buckling strength of the diaphragm is low, and the process is highly challenging

Method used

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  • Diaphragm and silicon capacitor microphone comprising same
  • Diaphragm and silicon capacitor microphone comprising same
  • Diaphragm and silicon capacitor microphone comprising same

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0017] The diaphragm provided by the invention is used in microelectronic devices, such as silicon capacitor microphones, loudspeakers, receivers and the like. Silicon condenser microphones are mainly used in electronic devices such as mobile phones to receive sound.

[0018] see figure 1 , the first embodiment provided by the present invention. The diaphragm 1 provided by the present invention includes a vibrating part 11 and a supporting part 12 connected to the vibrating part 11 , and the supporting part 12 extends away from the center of the vibrating part 11 from the outer circumference of the vibrating part 11 .

[0019] The support portion 12 has a first surface 121 , a second surface 122 opposite to the first surface 121 , and a sidewall 123 connecting the first surface 121 and the second surface 122 . The sidewall 123 includes a first sidewa...

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PUM

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Abstract

The invention provides a diaphragm. The diaphragm comprises a vibration part and a support part connected with the vibration part, wherein the support part stretches from the periphery of the vibration part to the direction which is away from the center of the diaphragm, and is provided with a first surface, a second surface opposite to the first surface, and a side wall which connects the first surface with the second surface; the side wall comprises a first side wall and a second side wall opposite to the first side wall; the first side wall and the second side wall are vertical to the connecting faces of the vibration part and the support part respectively; the support part comprises a first groove with a first opening and a second groove with a second opening; the first groove stretches from the second side wall to the first side wall; the first opening is formed on the first side wall; the second groove stretches from the first side wall to the second side wall; the second opening is formed on the second side wall; and the first side wall and the second side wall are crossed oppositely. The diaphragm can reduce stress gradient caused by the high stress of other structural layers to a film.

Description

technical field [0001] The invention relates to a vibrating membrane and a silicon capacitor microphone comprising the vibrating membrane. Background technique [0002] With the development of wireless communication, there are more and more mobile phone users around the world. The requirements of users for mobile phones are not only satisfied with calls, but also to be able to provide high-quality call effects. Especially the current development of mobile multimedia technology, the mobile phone Call quality is more important. The microphone of a mobile phone is used as a voice pick-up device for the mobile phone, and its design directly affects the call quality. [0003] Micro-Electro-Mechanical-System Microphone (MEMS for short) is currently the most widely used microphone with better performance. In related technologies, a silicon capacitor microphone includes a substrate, a back plate and a diaphragm. Among them, the diaphragm is an important part of the silicon condense...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R7/00H04R19/04
CPCH04R19/04
Inventor 葛舟张睿
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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