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Radiator and fan assembly

A heat sink fan and heat sink technology, which is applied in the direction of electric solid-state devices, semiconductor devices, cooling/ventilation/heating transformation, etc., can solve the problem of complex coordination between fans and heat sinks, and achieve the effect of saving manpower

Inactive Publication Date: 2011-05-18
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the cooperation between the fan and the radiator is more complicated.

Method used

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  • Radiator and fan assembly
  • Radiator and fan assembly
  • Radiator and fan assembly

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0014] Hereinafter, the radiator-fan combination of the technical solution will be described in detail with reference to the drawings and embodiments.

[0015] like figure 1 As shown, a radiator-fan assembly in this embodiment includes a radiator 10 , a fan 20 and a fixing member 30 for locking the fan 20 and the radiator 10 together. In this embodiment, four fixing pieces 30 are taken as an example for illustration.

[0016] combined figure 2 , image 3 , Figure 4 As shown, the heat sink 10 includes a bottom plate 110 for thermal contact with the heat-generating electronic components (not shown), a support frame 120 thermally matched with the bottom plate 110, a heat sink assembly 130 carried on the support frame 120, and the bottom plate 110 , a plurality of heat pipes 140 thermally connected to the support frame 120 and the heat sink assembly 130 . In this embodiment, two heat pipes 140 are taken as an example for illustration. Each heat pipe 140 includes an evapora...

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PUM

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Abstract

The invention relates to a radiator and fan assembly. The radiator and fan assembly comprises a radiator, a fan and a plurality of fixing pieces which fix the fan on the radiator, wherein the radiator comprises a support frame and a radiating fin assembly arranged on the support frame; the support frame is provided with a plurality of first fixing structures; the fan is arranged on the support frame, is adjacent to the radiating fin assembly, and comprises a plurality of second fixing structures corresponding to the first fixing structures; and each first fixing structure is fixedly locked with the corresponding second fixing structure by each fixing piece so as to fix the fan on the radiator. The fan is integrally locked with the radiator by using the common fixing pieces, and the structure of the whole radiator and fan assembly is simplified.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a radiator fan assembly. Background technique [0002] With the continuous improvement of the power of electronic components such as central processing unit (CPU), the problem of heat dissipation has been paid more and more attention by people. Generally, the industry installs a heat sink on the circuit board to dissipate heat from the heat-generating electronic components disposed on the circuit board. The heat sink generally includes a base in thermal contact with the electronic components and a plurality of cooling fins arranged on the base. In order to rapidly diffuse the heat absorbed by the cooling fins to the outside air, a fan is usually added to the radiator. [0003] Generally, the fan is fixed on a bracket by screws or other fasteners, and the radiator is further provided with a matching structure to fix the bracket to fix the fan on the radiator. The cooperation of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/467H01L23/427
CPCH01L23/4006H01L2023/4081H01L23/467H01L23/427H01L2924/0002H01L2924/00
Inventor 刘剑
Owner FU ZHUN PRECISION IND SHENZHEN
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