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Upgrading and backup method and device for embedded system

An embedded system, backup technology, applied in program control devices, response error generation, redundant data error detection in operation, etc., can solve the problem of increasing product upgrade costs, functional design errors, and inconvenient product maintenance work, etc. problems, to achieve the effect of improving maintainability, saving maintenance costs, and facilitating upgrades and maintenance.

Inactive Publication Date: 2011-05-25
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under normal circumstances, CPLDs are not changed after direct sintering during production, but due to functional updates or design errors, CPLDs also need to be updated
In this case, if the system cannot implement the online update function of the CPLD, it can only be upgraded on-site through the sintered cable of the Joint Test Action Group (JTAG, Joint Test Action Group), which will undoubtedly increase the upgrade cost of the product. Maintenance work brings great inconvenience

Method used

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  • Upgrading and backup method and device for embedded system
  • Upgrading and backup method and device for embedded system
  • Upgrading and backup method and device for embedded system

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Embodiment Construction

[0049] The technical solutions of the present invention will be further elaborated below in conjunction with the accompanying drawings and specific embodiments.

[0050] In the embedded system of the present invention, two FLASH chips are used as BOOTROM. Among them, the two FLASH chips are respectively: a small-capacity socket-type FLASH chip, and a large-capacity patch-type FLASH chip. The patch-type FLASH chip is divided into three partitions: the main BOOT area (MBOOT), the program area (APPVER), and the standby BOOT area (SLBOOT).

[0051] Based on the above-mentioned embedded system, the upgrade and backup method flow process of the embedded system of the present invention are as follows: figure 1 shown, including:

[0052] Step 101, in the BSP debugging stage, the BOOT boot program in the socket-type FLASH chip guides the CPU to start, and performs online upgrade of the CPLD through the CPU.

[0053] Step 102, in the initial use stage, upgrade the main BOOT boot prog...

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Abstract

The invention discloses an upgrading and backup method and device for an embedded system. The method comprises the following steps of: in a BSP (Board Support Package) debugging stage, booting a CPU (Central Processing Unit) to start by a BOOT program in a socket type FLASH chip and upgrading a CPLD (Complex Programmable Logic Device) on line through the CPU; in an initial use stage, upgrading a main BOOT program in a surface mount type FLASH chip, booting the CPU to start by the upgraded main BOOT program, and loading application program version by the CPU when the CPU starts successfully; and when the CPU is failed to start, booting the CPU to start by a standby BOOT program, and loading the application program version by the CPU when the CPU starts successfully. By the invention, the embedded system can be reliably, simply and conveniently upgraded with low cost.

Description

technical field [0001] The invention relates to an upgrade technology of an embedded system, in particular to an upgrade and backup method and device for an embedded system. Background technique [0002] At present, in the upgrade application of embedded systems in the fields of telecommunications and communications, socket flash memory (FLASH) chips are used as boot read-only memory (BOOTROM) to guide the central processing unit (CPU, Central Processing Unit) to load the method of the application program version is widely used. Although this method can conveniently carry out the sintering of the BOOT bootloader, the FLASH chip needs to be inserted and inserted every time the BOOTROM is sintered. In the process of system software debugging or in the case of system upgrade and maintenance, it is often necessary to update the BOOT bootloader. In this way, it is necessary to sinter the BOOTROM for many times, and after the socket-type FLASH chip is plugged and pulled out many ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F9/445G06F11/14
Inventor 邱炜潘杰何瑞金
Owner ZTE CORP
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