Photomask for forming fine pattern and method for forming fine pattern with the photomask
A fine pattern and photomask technology, applied in the field of photomask, can solve the problems of weakening intensity, reducing pattern size consistency, increasing light diffraction, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment approach 1-1
[0040] use figure 1 The photomask shown in , where C = 18 microns and a = 3 microns, was patterned by the following procedure.
[0041]First, a negative-working photosensitive solution (e.g., LGSP A series commercially available from LG Chem) was spin-coated on a glass substrate and electrically heated at 100 °C for two minutes to form a uniform thickness of 4 μm. membrane. Next, the film was exposed to a high-pressure mercury lamp for 3 seconds using a photomask, developed with a KOH alkaline aqueous solution having a pH of about 11.5, and washed with deionized water. Then, the pattern formed on the glass substrate was observed. The dimensions of the pattern are measured using an optical microscope and compared to the diameter C of the photomask pattern.
Embodiment approach 1-2
[0043] Embodiment 1-2 is the same as Embodiment 1-1, but uses figure 1 The photomask shown in -where C = 18 microns and a = 6 microns.
Embodiment approach 1-3
[0045] Embodiment 1-3 is the same as Embodiment 1-1, but uses figure 1 The photomask shown in -where C = 18 microns and a = 9 microns.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


