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Antenna welding process of non-contact intelligent card

A non-contact smart card and welding process technology, which is applied in welding equipment, manufacturing tools, metal processing equipment, etc., to achieve high production efficiency, solve repeated positioning accuracy, and improve product quality stability.

Inactive Publication Date: 2011-07-06
王莉萍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a new antenna welding process for non-contact smart cards in view of the problems existing in the existing non-contact card antenna and chip welding process

Method used

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  • Antenna welding process of non-contact intelligent card
  • Antenna welding process of non-contact intelligent card
  • Antenna welding process of non-contact intelligent card

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Embodiment Construction

[0019] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.

[0020] An antenna welding process for a contactless smart card, specifically comprising the steps of:

[0021] 1. See figure 1 , punching chip filling hole 110 in single-layer card base material 100; chip filling hole 110 is a rectangular hole

[0022] 2. See figure 2 , bury the antenna 200 on the single-layer card base material 100, the whole antenna 200 is surrounded by a rectangular frame, and the two ends 210, 220 of the antenna 200 are located on the left and right sides of the chip filling hole 110;

[0023] 3. See image 3 , filling the chip 300 in the chip filling hole 110;

[0024] 4. See Figure 4 , push the middle of the two ends 210, 220 of the antenna 200 toward the direction of the chip 300, and push it all the way to the sol...

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Abstract

The invention discloses an antenna welding process of a non-contact intelligent card, which specifically comprises the following steps of: 1, punching a chip filling hole in a single-layer card matrix; 2, embedding an antenna on the single-layer card matrix with two ends of the antenna positioned at the left side and the right side of the chip filling hole; 3, filling a chip in the chip filling hole; 4, pushing middles of two ends of the antenna to the direction of the chip until reaching welding regions at two ends of the chip to ensure that two ends of the antenna form a middle-concave shape; and 5, welding the middle-concave parts at two ends of the antenna with the welding regions of the chip. All steps are completed on a device. According to the invention, the problem of production line bottleneck with low embedding speed is solved, the chip filling and the chip and antenna welding are completed on the same automatic device, the problem of repeated positioning accuracy caused by multiple times of charging is solved, the antenna is ensured to be in center positions of the welding regions of the chip, the production efficiency is increased, and the product quality stability is improved.

Description

technical field [0001] The invention relates to the technical field of non-contact smart card manufacturing, in particular to an antenna welding process for a non-contact smart card. Background technique [0002] The current common non-contact card antenna and chip welding process includes the following steps: single-layer card base material punching (place chip hole) --- filling the chip --- burying the antenna on the card base material, and welding the antenna across the chip Above the area --- Antenna and chip soldering. [0003] In the traditional process, the buried antenna process step is the slowest step in the entire welding process, and the chip filling and antenna welding steps are faster than the buried antenna process step. Due to the speed matching of several steps, it is difficult to combine several processes. Process integration to be completed at one time with as few automated equipment as possible. In addition, in the traditional process, each process need...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K31/02
Inventor 王峻峰张耀华王莉萍王建
Owner 王莉萍