Method for calibrating temperature precision of temperature sensor chip

A temperature sensor and temperature calibration technology, applied in thermometer testing/calibration, thermometers, instruments, etc., can solve the problem of high testing cost, improve efficiency, meet the performance of testing and calibrating temperature sensor chips, and reduce testing steps and testing time.

Active Publication Date: 2011-07-06
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF0 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The method of calibrating the temperature accuracy of the traditional temperature sensor chip usually uses three-point temperature measurement or two-point temperature measurement method to correct the temperature accuracy, which is equivalent to two or more points to determine the slope and parallel deviation of the straight line. By adjusting the temperature sensor chip circuit Th

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for calibrating temperature precision of temperature sensor chip
  • Method for calibrating temperature precision of temperature sensor chip
  • Method for calibrating temperature precision of temperature sensor chip

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0016] An embodiment of the method for calibrating the temperature accuracy of the temperature sensor chip of the present invention is as follows: image 3 shown, including the following steps:

[0017] One. Design and produce the CMOS process temperature sensor chip, the CMOS process temperature sensor chip circuit includes a correction circuit, the temperature characteristic curve caused by the semiconductor bandgap voltage of the CMOS process temperature sensor chip circuit is ΔT real = AT 2 +BT+C, wherein the primary temperature coefficient B and the secondary temperature coefficient A are constants, and the correction circuit is used to correct the value of parameter C;

[0018] Two. According to the temperature characteristic curve ΔT caused by the semiconductor bandgap voltage of the CMOS process temperature sensor chip circuit determined during design and production real = AT 2 The primary temperature coefficient B and the secondary temperature coefficient A in +BT+...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for calibrating temperature precision of a temperature sensor chip. The method comprises the following steps of: designing and producing the temperature sensor chip, wherein the temperature sensor chip comprises a correction circuit, and a temperature characteristic curve caused by band gap voltage of a semiconductor is shown in the specification: deltaTreal=AT<2>+BT+C; determining symmetric center temperature Talphac; when the temperature sensor chip determines that output temperature is the symmetric center temperature Talphac through a test, adjusting a parameter value C by the correction circuit so as to change a vertex value deltaTreal_1 of the temperature characteristic curve deltaTreal caused by the band gap voltage of the semiconductor in the circuit of the temperature sensor chip; and finally completing calibration of the temperature precision of the temperature sensor chip. By utilizing the invention, the final output temperature precision of the temperature sensor chip can be calibrated only by one temperature test.

Description

technical field [0001] The invention relates to semiconductor integrated circuit design and testing technology, in particular to a method for calibrating temperature accuracy of a temperature sensor chip. Background technique [0002] With the continuous development of the integrated circuit industry and the continuous improvement of the market, customers have higher and higher requirements for electronic products, and lower and lower prices; thus, in order to control costs and improve efficiency, products are required to be optimized in all aspects. The expenditure should be as low as possible without affecting the performance of the product. The test steps of the final product of the sensor chip should be as simple as possible, and the single-chip test time should not be too much, so that the cost of the final test can be controlled. [0003] The method of calibrating the temperature accuracy of the traditional temperature sensor chip usually uses three-point temperature m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G01K15/00
Inventor 孟醒
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products