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Method for processing surface structure of aluminium substrate

A surface structure and treatment method technology, applied in the direction of surface reaction electrolytic coating, anodic oxidation, electrolytic coating, etc., to achieve the effect of promoting tight bonding, increasing bonding force, and improving high-voltage resistance

Inactive Publication Date: 2011-07-20
惠州市绿标光电科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for treating the surface structure of an aluminum substrate, aiming at solving the problems existing in the prior art

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  • Method for processing surface structure of aluminium substrate
  • Method for processing surface structure of aluminium substrate
  • Method for processing surface structure of aluminium substrate

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Embodiment Construction

[0018] Below in conjunction with accompanying drawing and by embodiment the present invention will be described in further detail:

[0019] The method for treating the surface structure of the aluminum substrate provided by the present invention is a nano-processing method, mainly forming a rough and uniform honeycomb shape on the aluminum surface by pulse electroplating.

[0020] The method for treating the surface structure of the aluminum substrate of the present invention specifically includes the following steps:

[0021] S100. Pretreatment: Soak the aluminum substrate in NaOH solution with a water concentration of 10% for 10 minutes, and control the temperature at 40-45°C;

[0022] S200. Pulse electroplating: Use sulfuric acid, phosphoric acid, and oxalic acid to prepare the reaction solution in proportion, and then put the pretreated aluminum substrate into the reaction solution for pulse electroplating. The temperature is controlled between 13-24°C and the current dens...

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Abstract

The invention discloses an aluminium substrate surface structure processing technology. The aluminium substrate obtained by adopting the aluminium substrate surface structure processing method disclosed by the invention has the advantages that a uniform cellular uneven surface on an aluminium surface can improve the bonding force with a prepreg in each direction, the tight coupling between the aluminium substrate and PP (polypropylene) sheets can be effectively enhanced and the high pressure resistance is improved compared with a mechanically processed aluminium plate.

Description

technical field [0001] The invention relates to the technical field of metal plates used in printed circuit boards, in particular to a method for treating the surface structure of an aluminum substrate. Background technique [0002] With the popularization and wide application of electronic products, the technology of using metal substrates to make printed circuit boards is also constantly updated and developed; for example, in order to meet the development and needs of various electronic products, printed circuit boards based on aluminum substrates have been From single-sided aluminum substrates to double-sided aluminum substrates or even multi-sided aluminum substrates, that is, to install aluminum plates on one side or interlayer of the original printed circuit board products to increase the heat dissipation effect, improve the quality of use of electronic products and prolong the service life; thus aluminum substrates The reliability of the combination with the insulatin...

Claims

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Application Information

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IPC IPC(8): C25D11/08C25D11/24
Inventor 邵国生
Owner 惠州市绿标光电科技有限公司
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