Method for processing surface structure of aluminium substrate

A surface structure and treatment method technology, applied in the direction of surface reaction electrolytic coating, anodic oxidation, electrolytic coating, etc., to achieve the effect of promoting tight bonding, increasing bonding force, and improving high-voltage resistance

Inactive Publication Date: 2011-07-20
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AI-Extracted Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for treating the surface ...
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Method used

Obviously, compared with traditional physical method, owing to adopting the nano-processing technology provided by the present invention to process aluminum subs...
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The invention discloses an aluminium substrate surface structure processing technology. The aluminium substrate obtained by adopting the aluminium substrate surface structure processing method disclosed by the invention has the advantages that a uniform cellular uneven surface on an aluminium surface can improve the bonding force with a prepreg in each direction, the tight coupling between the aluminium substrate and PP (polypropylene) sheets can be effectively enhanced and the high pressure resistance is improved compared with a mechanically processed aluminium plate.

Application Domain


Technology Topic

PolypropyleneAluminium +4


  • Method for processing surface structure of aluminium substrate
  • Method for processing surface structure of aluminium substrate
  • Method for processing surface structure of aluminium substrate


  • Experimental program(1)

Example Embodiment

[0018] In the following, the present invention will be further described in detail with reference to the drawings and embodiments:
[0019] The method for processing the surface structure of the aluminum substrate provided by the present invention is a nano-processing method, which mainly forms a rough and uniform honeycomb shape on the aluminum surface by pulse electroplating.
[0020] The method for processing the surface structure of the aluminum substrate of the present invention specifically includes the following steps:
[0021] S100. Pre-treatment: Soak the aluminum substrate with a NaOH solution with a concentration of 10% for 10 minutes, and the temperature is controlled at 40-45°C;
[0022] S200. Pulse electroplating: configure the reaction solution with sulfuric acid, phosphoric acid, and oxalic acid in proportion, and then put the pre-treated aluminum substrate into the reaction solution for pulse electroplating. The temperature is controlled between 13-24℃ and the current density is 1-1.5 A/dm 2;
[0023] S300. Post-processing: Pass the pulse-plated aluminum substrate through an ultrasonic cleaning machine, and then immerse it in 5WT% phosphoric acid or 1% oxalic acid solution for reaming, thinning, and the temperature is room temperature; finally, rinse with water, at 150 Dry at ℃ for 10~15min.
[0024] In step S200, in the reaction solution, the concentration of sulfuric acid is 1.2%, the concentration of phosphoric acid is 1.0%, and the concentration of oxalic acid is 0.3%. The pulse plating treatment time is 10-20 minutes.
[0025] The aluminum substrate processed by the surface structure treatment method provided by the present invention can be used to assist heat dissipation on a single side or interlayer of a printed circuit board; at least one side of the aluminum substrate has a rough surface for increasing insulation Binding force between; one of its specific implementation methods, such as figure 1 As shown, the rough surface is a pit formed by nano-processing technology. For the aluminum substrate set on one side of the printed circuit board, one side can be a rough surface with pits, and the other side can be a smooth surface with a protective film; for the aluminum substrate set in the interlayer of the printed circuit board, both sides can be The rough surface of the pits. Such as figure 2 As shown, the faults of the rough surface are wavy. The wavy fault can be a cross section, a longitudinal section, or even a cross section in any direction to ensure the isotropy of the combination with the prepreg, which can effectively promote the close combination with the insulating sheet such as polyethylene, and further improve High pressure resistance of the finished printed circuit board.
[0026] Obviously, compared with the traditional physical method, due to the nano processing technology provided by the present invention for processing the aluminum substrate, burrs will not be formed on the surface of the aluminum substrate, and the high pressure resistance of the finished printed circuit board is improved.


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Description & Claims & Application Information

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