Circuit board and probe card formed by circuit board

Abstract

The invention discloses a circuit board and a probe card formed by the circuit board. The probe card comprises the circuit board, wherein a bump is formed on at least one side of the circuit board; a plurality of inner contacts are arranged on a surface of the bump; a plurality of outer contacts are arranged on the surface of the other side of the circuit board on which the bump is formed; conductive lines are arranged in the circuit board and connected between each inner contact and each outer contact, so that each outer contact can be connected with an external test circuit electrically through a lead; an impedance coaxial line can be added into the conductive lines in an adjacent region of a boundary position between the circuit board and the bump so as to improve yield; moreover, a probe fixing device can be combined with one side, abutting against the bump, of the circuit board, through a fixed ring pad; a hollow part is arranged on the fixed ring pad and can be combined around the bump; the probe fixing device can clamp one end of each of a plurality of probes so as to facilitate contact with each inner contact; and the other end of each probe can be pressed against each pinof an integrated circuit chip to be tested stably to form electric connection.

Description

Technical field [0001] The invention relates to a circuit board and a probe card structure formed by using the circuit board, in particular to a test circuit board with simple structure, low cost and good circuit signal transmission quality, and a probe card structure formed by the circuit board Needle card structure. Background technique [0002] Generally, circuit boards and electronic components (especially more sophisticated integrated circuit chips) need to be tested to determine whether their quality meets the specifications after molding. The more common testing method is a test card (such as an integrated circuit test card). ) Is set between the circuit board, electronic component (such as an integrated circuit chip) and the related test device, so that each contact of the circuit board or electronic component can be electrically connected with the corresponding contact of the test device, thereby performing various test actions; [0003] The traditional and common circuit...

AI Technical Summary

Problems solved by technology

[0006] 2. Since there are conductive lines (104, 63) and internal contacts 61, solder balls 62, connecting contacts 102, external contacts 13, etc. between the contacts of the integrated circuit chip to be tested and the external test circuit or device (instrument). The overall circuit impedance is not easy to control, and the exposure is high, it is easy to be interfered by noise, and it is difficult to maintain the excellent quality of its circuit signal transmission

[0007] 3. Due to the complexity of the contacts between the IC chip to be tested and the external test circuit, and the high impedance, the overall impedance matching is difficult to control, and it is easy to affect the actual test quality

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