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Modular layout method of silicon-based array and modular silicon-based array

An array, silicon-based technology, applied in the field of modularly arranged silicon-based arrays

Inactive Publication Date: 2019-08-06
XEROX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, apparatus 400 provides a full-color print capability of 600 dots per inch, but requires more than 787 mm in the process direction

Method used

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  • Modular layout method of silicon-based array and modular silicon-based array
  • Modular layout method of silicon-based array and modular silicon-based array
  • Modular layout method of silicon-based array and modular silicon-based array

Examples

Experimental program
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Embodiment Construction

[0023] figure 1 is a plan view of the silicon-based module 100 . The module includes chip assemblies 102 and 104 on a substrate 106 . In one example implementation, the chip assembly 102 includes a silicon chip 108 and a driver die 110 with circuitry. In one example implementation, the chip assembly 104 includes a silicon chip 112 and a driver die 114 with circuitry. In one example implementation, flex circuits (not shown) are used to link the driver die to external circuitry and power supplies. In one example embodiment, assemblies 102 and 104 are the same type of assembly or perform the same function. Corresponding portions of the assemblies 102 and 104 are aligned in the longitudinal direction L of the substrate. By longitudinal direction is meant the long axis of the substrate, or the direction perpendicular to the processing direction of the device in which the substrate is to be used (eg, in an array for printing or scanning devices). In an example embodiment, the ...

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PUM

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Abstract

A silicon-based module, comprising: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having a circuit; and a first chip assembly fixed to the substrate A second chip assembly includes a second silicon chip and a second driver die with circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction of the substrate; and portions of the first and second silicon chips are aligned in a width direction perpendicular to the longitudinal direction. A method for forming silicon-based modules.

Description

technical field [0001] The present disclosure relates to methods of modularly arranging silicon based arrays and modular silicon based arrays, and more particularly to end-to-end arrays of modules. Background technique [0002] Figure 7 A prior art multi-chip array 300 is shown in which a series of individual chips 302 are placed end-to-end on a single substrate 304 . Improper spacing may occur at the joints between chips, affecting the operation of that chip. For example, for chips with ink jets, jet interpolation is required at the chip boundary, and for photosensitive chips, the imaging at this joint may not be paired. Additionally, extending multi-chip silicon-based arrays presents precision issues and requires the use of expensive equipment and operations. Further, the expected operation of individual chips cannot be fully tested before placing the chips in an array. Many such multi-chip arrays cannot easily repair defective chips, and the repair of defective jobs i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/98H01L27/10
CPCB41J2202/19H01L22/20H01L25/0655H01L25/16H01L2924/0002H01L2924/014H01L2924/00B41J2/17566B41J2/17596
Inventor 马克 A·塞吕拉彼得 J·奈斯特龙司各特 J·菲利普斯约翰 P·迈尔斯莱尔 G·丁曼布赖恩 R·多兰
Owner XEROX CORP