Step-by-step projection photo-etching machine double set shifting exposure ultra-sophisticated positioning silicon chip bench system

Abstract

A step-by-step projection photo-etching machine double shift exposure ultra precise positioning silicon chip bench system, comprising a silicon chip bench positioning unit operating in the exposure station, and a silicon chip bench positioning unit operating in the preliminary treatment station, each positioning unit includes a silicon chip carrying device. The system can increase the exposure efficiency without the problem of overlapping and interference in the working space. It also realizes simplified structure, and high reliability and positioning precision.

Description

technical field [0001] The invention relates to an ultra-precise motion positioning system for silicon wafers in the photoetching process. The system can be used for both scanning photoetching machines and stepping photoetching machines. Background technique [0002] In the production process of integrated circuit chips, the exposure transfer (photolithography) of the design pattern of the chip on the photoresist on the surface of the silicon wafer is one of the most important processes. The equipment used in this process is called a photolithography machine (exposure machine). The resolution and exposure efficiency of the lithography machine greatly affect the characteristic line width (resolution) and productivity of the integrated circuit chip. As the main component of the lithography machine, the motion accuracy and work efficiency of the silicon wafer ultra-precision motion positioning system determine the resolution and exposure efficiency of the lithography machine t...

AI Technical Summary

Problems solved by technology

The main difference between the two is that the scanning lithography machine has a mask motion positioning system that can perform large-scale scanning motion positioning, while the stepping lithography machine does not

[0008] However, there are still some problems in this dual-stage structure: first, when the two wafer stages are exchanged, the two silicon wafer stages will be in a free state for a short period of time, which will undoubtedly have a certain impact on the positioning accuracy of the system , and to solve this problem would complicate the structure

The second is that there is an overlapping area in the motion range of the two wafer stages, which will cause the two stages to collide during the movement, and the consequences will be disastrous

For this reason, anti-collision control devices and detection devices must be added, which will also complicate the system and reduce reliability.

Third, since the silicon wafer table will inevitably have a large number of cables, it will be more difficult to handle the cables in the process of realizing the exchange of this structure.

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