Elastic thermal conduction structure for multiple heat sources of fanless electronic device

Abstract

The invention provides an elastic thermal conduction structure for multiple heat sources of a fanless electronic device. The invention adopts the following technical scheme: the structure comprises a case and an outer shell, wherein housing space capable of housing a circuit substrate is formed inside the case; the circuit substrate is provided with a plurality of heating sources in different height; two or more through holes for elastic positioning parts to penetrate through and a plurality of joint holes arranged at the corners outside the through holes are respectively arranged around eachheating source so that the outer shell is combined at the side of the case; thermal conduction media are arranged in preset gaps respectively formed by a plurality of protruding parts on the inner side wall surface of a radiating base of the outer shell and the heating sources; a plurality of positioning portions at the corners outside the protruding parts respectively penetrate through the jointholes on the circuit substrate; then the elastic positioning parts are locked in corresponding fixing portions around the protruding parts to form a whole; and the thermal conduction media can be thermal pads or radiating grease to ensure good elastic pushing and sticking and close states between the heating sources and the protruding parts on the radiating base so as to effectively reduce the thermal resistance, so the integral thermal conduction effect can be improved.

Description

technical field [0001] The invention provides an elastic heat conduction structure with multiple heat sources for a fanless electronic device, especially the outer casing is combined with the side of the casing, so that the multiple protrusions on the wall surface of the cooling seat and the heat sources of different heights on the circuit board are provided. The predetermined gap is provided with a heat conduction medium, and forms a good elastic contact and close contact state, supplemented by effectively reducing thermal resistance and improving the effect of overall heat conduction. Background technique [0002] With the advent of today's diversified information age, all kinds of electronic products are flooding around the living environment. With the continuous innovation and progress of science and technology, electronic products are also moving toward multi-function, purpose and additional hardware equipment. Many All electronic products use computers to control their...

AI Technical Summary

Problems solved by technology

[0004] However, for this kind of heat conduction structure with multiple heat sources, in the face of the need to use thinner (low thermal resistance coefficient, less compression) thermal pads or thinner thermal paste, it is often due to computer housing tolerances (such as process, material etc.) caused by uneven surface or tiny defects, so that the thermal pad or heat dissipation paste can not touch the surface of the chip, or the poor thermal conductivity caused by the inability to make a good contact, even during the assembly process , the contact force under the strong pressure of the user is too large to cause deformation, damage to the circuit board or damage to the chip, which leads to the fact that the heat conduction structure of this heat source is limited by the use of thicker thickness (high thermal resistance coefficient, compression amount) Large) thermal pads, and in actual use, there will still be problems related to poor structural stability and poor heat dissipation, which need to be redesigned by those engaged in this industry to solve them

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