Arrangement method and structure of bridge electrode

Abstract

The invention relates to an arrangement method and a structure of a bridge electrode. The arrangement method of the bridge electrode comprises the following steps of: providing a substrate; forming a transparent conductive layer on the substrate, wherein the transparent conductive layer is provided with a plurality of pattern blocks which are arranged adjacent to each other; forming an alignment film layer on the substrate, wherein the alignment film layer is provided with a plurality of bridge grooves used for crossing among the plurality of pattern blocks; forming a conductive layer on the substrate, wherein the conductive layer is provided with a plurality of electrical conductors which are respectively arranged on the plurality of bridge grooves, the plurality of electrical conductorsof the conductive layer are formed by an optical compensation photomask together with over exposure or over development; and forming a protective layer on the substrate, wherein the protective layer is used for increasing optical transmittance and protecting the substrate, the transparent conductive layer, the alignment film layer and the conductive layer.

Description

technical field [0001] The present invention relates to an electrode layout method and its structure, especially using a special photomask to form a bridging groove on an insulating unit, so that the wires placed in the bridging groove are not likely to cause poor overall yield due to subsequent manufacturing processes. The layout method and structure of the bridging electrodes. Background technique [0002] In the known technology, in the manufacturing process of the capacitive touch panel, electrodes with two different axes are formed on the substrate, and an insulating layer is formed again on the electrodes of one axis to provide the electrodes of the other axis. The electrodes are electrically connected through metal wires provided on the insulating layer. [0003] However, the metal wires traditionally disposed on the insulating layer may be damaged in the subsequent manufacturing process, making the conduction impossible, thereby causing a decline in the production y...

AI Technical Summary

Problems solved by technology

[0003] However, the metal wires traditionally arranged on the insulating layer may be damaged in the subsequent manufacturing process, making it impossible to conduct, and then resulting in a decline in the production yield of the capacitive touch panel.

[0004] In addition, in general factories, in terms of photomask design, the pattern line width of the production photomask is the same as the pattern line width of the required molding circuit, which cannot effectively overcome the above-mentioned problems, and after development, the photoresist remains seriously, Phenomena such as incomplete development and excessive development will also exist at the same time, and it is easy to cause poor appearance (jagged or wavy edges of the line) or poor electrical properties (abnormal reliability test) after etching.

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