Silicon crystal line cutting equipment

A technology of silicon crystal and multi-wire cutting, which is applied in stone processing equipment, fine working devices, manufacturing tools, etc., can solve the problems of insufficient contact between workpiece and cutting fluid, production capacity, rare and low cutting area, and solve production costs Excessively high, high utilization rate, the effect of ensuring cutting quality

CN102172997BActive Publication Date: 2014-09-24海宁市日进科技有限公司
6 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2014-09-24

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention provides silicon crystal multi-line cutting equipment for line cutting operation of a crystal silicon ingot to be cut. The equipment comprises a liquid accommodating tank for soaking the crystal silicon ingot to be cut into cutting solution, and a multi-line cutting device for forming a cutting net; the falling cutting net presses the liquid accommodating tank and the crystal silicon ingot to be cut in the cutting solution, so that the cutting lines cut the crystal silicon ingot to be cut in the cutting solution at the same time of cutting the side plates of the liquid accommodating tank; and in the cutting process, the cutting solution flows out from the breaches of the side plates of the cut liquid accommodating tank so as to facilitate reclamation. The equipment solves the problem that sparse cutting solution is brought to the cutting area in the cutting process, so that the cutting efficiency is greatly improved, and the problems of low capacity and the like because the cutting lines, the workpiece and the cutting solution are not fully contacted are solved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a wire cutting technology, in particular to a silicon crystal multi-wire cutting device for improving the utilization rate of cutting fluid and reducing production costs. Background technique

[0002] Multi-wire cutting technology is a relatively advanced crystalline silicon processing technology in the world at present. Its principle is to use a high-speed moving steel wire to drive the cutting blade attached to the steel wire to rub against hard and brittle materials such as semiconductors to achieve the cutting effect. Compared with the traditional saw blade, grinding wheel and inner circle cutting, the multi-wire cutting technology has the advantages of high efficiency, high productivity and high precision. The multi-wire cutting technology is currently the most widely used cutting technology for hard and brittle materials such as semiconductors.

[0003] Existing multi-wire cutting equipment such as crystalline silicon ing...

Examples

Embodiment Construction

[0021] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0022] see Figure 1 to Figure 4 , figure 1 It is a schematic diagram showing a simplified structure of the silicon crystal multi-wire cutting equipment of the present invention; Figure 2A It is shown as a structural schematic diagram of the liquid holding tank in the present invention; Figure 2B shown as Figure 2A The enlarged schematic diagram of A; Figure 3A It is a schematic diagram showing the state of crystalline silicon...