Additive for electrolytic copper foil, electrolytic copper foil manufacturing process and electrolytic copper foil

A technology of electrolytic copper foil and production process, which is applied in the direction of electrolysis, electroforming, etc., can solve the problems of processing procedures that affect the appearance and quality of copper foil, easily produce copper nodules and copper powder, and the thickness of copper foil cannot be achieved. Rough, low-cost, medium-brightness effect

Active Publication Date: 2011-09-14
惠州联合铜箔电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the copper foil of ordinary specifications cannot meet the requirements of the above-mentioned shielding materials. Electrolytic copper foil for thick shielding, the copper foil will have a large surfa

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] The electrolytic copper foil of this embodiment is first to obtain the required copper foil semi-finished product after the raw material copper wire is subjected to copper-dissolving solution, electrolytic raw foil, on-line trimming and on-line anti-oxidation treatment, and then the semi-finished copper foil is inspected and packaged Finally, the finished copper foil is obtained, and the specific operation process is as follows:

[0046] Step 1. Copper solution

[0047] After the raw material copper wire is annealed to remove organic impurities, it is sent to the copper melting tank, and the solution containing sulfuric acid (sulfuric acid content is 90~130g / L) is sprayed on the copper wire to dissolve the copper wire and make copper sulfate electrolysis liquid; control indicators such as copper content, sulfuric acid content, zinc content, iron content, chlorine content and temperature in the copper sulfate electrolyte reach the range specified in Table 1;

[0048] St...

Embodiment 2

[0067] The electrolytic copper foil of this embodiment is first to obtain the required copper foil semi-finished product after the raw material copper wire is subjected to copper-dissolving solution, electrolytic raw foil, on-line trimming and on-line anti-oxidation treatment, and then the semi-finished copper foil is inspected and packaged Finally, the finished copper foil is obtained, and the specific operation process is as follows:

[0068] Step 1. Copper solution

[0069] After the raw material copper wire is annealed to remove organic impurities, it is sent to the copper melting tank, and the solution containing sulfuric acid (sulfuric acid content is 90~130g / L) is sprayed on the copper wire to dissolve the copper wire and make copper sulfate electrolysis liquid; control indicators such as copper content, sulfuric acid content, zinc content, iron content, chlorine content and temperature in the copper sulfate electrolyte reach the range specified in Table 1;

[0070] St...

Embodiment 3

[0089] In the production process of the electrolytic copper foil of this embodiment, except for the flow rate of additives and the electrolytic raw foil process in step 2, other steps are the same as in embodiment 1.

[0090] The additive formula and flow rate of this embodiment, and the process conditions of the electrolytic raw foil are as follows:

[0091] The formula of described additive is: copper brightener: gelatin: hydroxycellulose: leveling agent: wetting agent: the weight ratio of water is 0.1:5:1:0.2:0.4:50; The flow rate of additive is 6.3L / h ;

[0092] The electroplating current is 18000A;

[0093] The rotating speed of described negative roller is 0.26m / min;

[0094] The electrolyte flow rate is 35m 3 / h (flow into the anode plate tank).

[0095] The physical properties of the copper foil prepared in this example are:

[0096] Nominal thickness: 105 microns;

[0097] Mass per unit area: 915.22g / m 2 ;

[0098] Pinholes and penetration points: none;

[00...

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Abstract

The invention discloses an additive for an electrolytic copper foil, an electrolytic copper foil manufacturing process and the electrolytic copper foil. The additive consists of a copper brightener, gelatin, carboxyl cellulose, a leveling agent, a wetting agent and water, wherein the weight ratio of the copper brightener to the gelatin to the carboxyl cellulose to the leveling agent to the wetting agent to the water is 0.1: 5: 1: 0.2: 0.4: 50. The additive for the electrolytic copper foil controls the brightness of the copper foil in such a manner that the carboxyl cellulose is used for assisting in the copper brightener, so that the copper coil not only has moderate brightness, but is also free from rough surface. The electrolytic copper foil manufacturing process has the advantages of being simple in operation and low in cost, and the prepared electrolytic copper foil has the advantages of quite high thickness, low profile, large area, no porosity, good thickness uniformity, high purity, excellent electric conductivity and the like, is capable of meeting the demands of medical apparatuses and military industry, and can be widely applied to information shielding safety products, military products or medical apparatus products.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to the technology of electrolytic copper foil for shielding, in particular to an additive used in the production of ultra-thick electrolytic copper foil for shielding, and a production process for producing ultra-thick electrolytic copper foil for shielding by using the additive. And the electrolytic copper foil prepared by the production process. Background technique [0002] Shielding materials are mainly used in fields such as electric field shielding, magnetic field shielding, or electromagnetic shielding combining electric and magnetic fields. The materials used are made of composite materials, which often have defects such as small shielding area, uneven thickness, and high production costs. Some areas that need to be shielded over a large area (such as making a shielded room) will incur high costs. [0003] Electrolytic copper foil is also a kind of shielding ...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D3/38
Inventor 周启伦郑惠军朱各桂万新领黄国平邓烨杨孝坤高元亨吴燕林
Owner 惠州联合铜箔电子材料有限公司
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