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Printed wiring board manufacturing method and printed wiring board

A technology for printed circuit boards and manufacturing methods, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of not considering signal transmission improvement, etc.

Inactive Publication Date: 2011-10-05
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, improvements to signal transmission are not considered at all

Method used

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  • Printed wiring board manufacturing method and printed wiring board
  • Printed wiring board manufacturing method and printed wiring board
  • Printed wiring board manufacturing method and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Embodiments of the printed wiring board manufacturing method and the printed wiring board of the present invention will be described below with reference to the accompanying drawings.

[0021] Figure 1A with Figure 1B A printed wiring board as a comparative example is shown. exist Figure 1A with Figure 1B In , each reference numeral has a suffix "C" to denote a comparative example in a distinguishing manner.

[0022] Figure 1A is a plan view of a printed wiring board 10C as a comparative example, and Figure 1B is when viewed in the direction indicated by the arrow along the Figure 1A A cross-sectional view taken along line A-A in . It should be noted that, Figure 1A The resin plate including the glass fiber cloth impregnated with resin is omitted in .

[0023] The printed wiring board 10C includes: a glass fiber cloth 20C obtained by weaving warp yarns 21C and weft yarns 22C into a cloth form, a resin board 30C obtained by impregnating the glass fiber cloth ...

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PUM

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Abstract

The invention provides a printed wiring board manufacturing method and a printed wiring board. The printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

Description

technical field [0001] Embodiments discussed herein relate to printed wiring board manufacturing methods and printed wiring boards. Background technique [0002] Some printed wiring boards employ a core substrate on which differential signal wiring pairs are patterned. When the core substrate is manufactured by impregnating glass cloth made of warp and weft with resin, at a transmission frequency of, for example, 1.6 GHz or below, due to the positional relationship between the uneven position of the glass cloth and the differential signal wiring, The resulting delay in signal transmission in the core substrate may not pose a significant problem. [0003] Meanwhile, in the case where the transmission frequency is increased to a range of 3 to 5 GHz, signal transmission delay with a difference at a non-negligible level may be generated, or impedance mismatch may be caused. To address delay time differences and impedance mismatches, techniques have been proposed that provide, ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/02
CPCH05K2201/09236H05K1/0245H05K2201/0969H05K2201/029H05K1/0248H05K3/4638H05K1/0269H05K2203/167H05K1/0366Y10T29/49117Y10T29/49155Y10T29/49165
Inventor 山田哲郎大井誉裕森田义裕松井亚纪子菅根光彦向山孝英
Owner FUJITSU LTD